United Microelectronics Corp (UMC) 2.12 $UMC
United Microelectronics Corporation to Report First Quarter 2014 Financial Results on April 30, 2014 US Time
GlobeNewswire - Wed Apr 16, 4:00AM CDT
United Microelectronics Corporation (NYSE:UMC) (TWSE:2303), a leading independent semiconductor foundry, will hold its quarterly conference call to discuss first quarter 2014 results on Wednesday, April 30, 2014, at 5:00 a.m. US Eastern Time.
Information Technology Equities Technical Commentary -- Research on LivePerson, ModusLink Global Solutions, Fiserv, and United Microelectronics
PR Newswire - Thu Apr 10, 11:30AM CDT
On Wednesday, April 09, 2014, the NASDAQ Composite ended at 4,183.90, up 1.72%, the Dow Jones Industrial Average finished 1.11% higher at 16,437.18, and the S&P 500 closed at 1,872.18, up 1.09%. The gains were broad based as eight out of ten sectors finished on a higher note. The S&P 500 Information Technology Sector Index gained 1.56% to finish the day at 596.87, and the same has gained 3.33% in the previous three months. Investor-Edge has initiated coverage on the following equities: LivePerson Inc. (NASDAQ: LPSN), ModusLink Global Solutions Inc. (NASDAQ: MLNK), Fiserv Inc. (NASDAQ: FISV) and United Microelectronics Corp. (NYSE: UMC). Free technical research on LPSN, MLNK, FISV and UMC can be downloaded upon signing up at:
UMC Reports Sales for March 2014
PR Newswire - Wed Apr 09, 2:12AM CDT
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"
, today reported unaudited net sales for the month of March 2014.
3D Transistor Trends 2014 - The Next-Generation Transistors
M2 - Wed Mar 19, 9:59AM CDT
Research and Markets (http://www.researchandmarkets.com/research/h8nwdv/3d_transistor) has announced the addition of the "3D Transistor Trends" report to their offering. The report projects that 3D Transistors is set to become the norm as a 3D transistor is an advanced transistor that is manufactured by using nano wires in comparison to traditional usage of silicon. The development of 3D Transistors is likely to change the dynamics of semiconductor manufacturing industry. The manufacturing process of 3D transistors involves a top-down method, wherein components of the transistor are etched on the transistor's base. The nano wires, made of iridium, gallium as well as arsenide semiconductors, are layered with a thinner dielectric made of lanthanum aluminate for performing the gate operation efficiently with reduced voltage requirements. Key Topics Covered: 1. 3D TRANSISTORS - AN OVERVIEW - Transistors - An Introduction - 3D Transistors - The Next-Generation Transistors - 3D Transistors Vs. 2D Transistors - 3D Transistors - Advantages - Future Developments - 3D Chips - Applying 3D Transistors to Improve Performance of Future Electronic Devices - Stacking Techniques - 3D Chips-Major Challenges to Overcome - Recent 3D Chip-based Developmental Activities - TSMC to Challenge Intel's Leadership in Advanced Semiconductor Manufacturing Technology 2. END-USE APPLICATIONS - 3D-Enabled Smartphones - Media Tablets - Ultrabooks - Netbooks 3. RECENT INDUSTRY ACTIVITY - Altera and Intel Enter into Partnership - Synopsys and Samsung Announce Tapeout of First 14-nanometer FinFET-based Test Chip - TSMC Partners with ASML - United Microelectronics and IBM Technology Ink Agreement - Soitec and SEMATECH Enter into Partnership 4. PRODUCT LAUNCHES/INNOVATIONS - IEMN and LAAS-CNRS Develop 3D Nanometric Transistor - Synopsys Unveils Comprehensive Solution of EDA IP and Tools - Intel Unveils Range of Quad-Core 3rd Generation Processors - Globalfoundries Unveils 14-nanometer eXtreme Mobility Process - Intel Unveils Xeon Server Processors - Intel Introduces Tri-Gate 3D Transistor - Intel Unveils Silvermont Atom Chip Architecture 5. MARKET PARTICIPANTS - Globalfoundries, Inc. (USA) - Intel Corporation (USA) - Laboratoire D'analyse ET D'architecture Des Syst?mes (LAAS- CNRS) (France) - National Institute of Advanced Industrial Science and Technology (AIST) (Japan) - Samsung Semiconductor, Inc. (USA) - Soitec SA (France) - Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) (Taiwan) - Unisantis Electronics (Japan) Ltd. (Japan) 6. APPENDIX For more information visit http://www.researchandmarkets.com/research/h8...transistor
Concise Analysis of the International Semiconductor Foundry Market - Forecasts to 2016
M2 - Thu Mar 13, 5:11AM CDT
Research and Markets (http://www.researchandmarkets.com/research/w52z32/global) has announced the addition of the "Concise Analysis of the International Semiconductor Foundry Market - Forecasts to 2016" report to their offering. The Global Semiconductor Foundry market is witnessing an increasing consolidation and strategic alliances between market players, which are expected to continue even in the future. Both existing vendors and new entrants prefer the acquisitive route to either enter the market or broaden their portfolio of offerings. For instance, Hua Hong NEC Electronics and Grace Semiconductor Manufacturing Corp. completed their merger in 2011. In addition, IBM, Global Foundries, and Samsung Electronics Co. Ltd. have formed an alliance in the market. Since the market is highly fragmented and competitive, players are adopting strategies such as alliances, agreements, and mergers to sustain the competition. According to the report, one of the main drivers is the restocking of inventory by customers. As the demand for semiconductor devices is increasing, customers are replenishing the stock to keep pace with the current as well as near-future market conditions. For the past few years, this has been one of the major contributing factors to the growth of the market. Further, the report states that one of the major challenges in this market is the fluctuating revenue of the Semiconductor industry. The major reason for this fluctuating revenue is the fluctuating demand for the products in this industry. Key Topics Covered: 1. Executive Summary 2. List of Abbreviations 3. Introduction 4. Market Research Methodology 5. Scope of the Report 6. Market Landscape 7. Geographical Segmentation 8. Key Leading Countries 9. Vendor Landscape 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Key Vendor Analysis 17. Other Reports in this Series Companies Mentioned: - Apple Inc. - Dongbu HiTek Co. Ltd. - GlobalFoundries Inc. - IBM Microelectronics - Magnachip Semiconductor Corp. - Powerchip Technology Corp. - Samsung Semiconductor Inc. - Semiconductor Manufacturing International Corp. - Taiwan Semiconductor Manufacturing Co. Ltd. - Tower Semiconductor Ltd. (TowerJazz) - United Microelectronics Corp. - Vanguard International Semiconductor Corp - WIN Semiconductors Corp (GaAs) For more information visit http://www.researchandmarkets.com/research/w52z32/global
UMC Reports Sales for February 2014
PR Newswire - Mon Mar 10, 1:44AM CDT
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC" , today reported unaudited net sales for the month of February 2014.
Global 3D ICs Market to 2019: MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED
M2 - Thu Feb 20, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/35kchv/3d_ics_market) has announced the addition of the "3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" report to their offering. The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide. This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019. The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments. Scope End-Use Sectors - Consumer electronics - Information and communication technology - Transport (automotive and aerospace) - Military - Others (Biomedical applications and R&D) Substrate Type: - Silicon on insulator(SOI) - Bulk Silicon Fabrication Process: - Beam re-crystallization - Wafer bonding - Silicon epitaxial growth - Solid phase crystallization Product - MEMS and Sensor - RF SiP - Optoelectronics and imaging - Memories (3D Stacks) - Logic (3D Sip/Soc) - HB LED Key Topics Covered: Chapter 1 Preface Chapter 2 Executive Summary Chapter 3 3D ICs Market Overview Chapter 4 Global 3D ICs Market, by End-Use Industry Chapter 5 Global 3D ICs Market, by Substrate Type Chapter 6 Global 3D ICs Market, by Fabrication Process Chapter 7 Global 3D ICs Market, by Product Chapter 8 Global 3D ICs Market, by Geography Chapter 9 Company Profiles - Elpida Memory, Inc. (Micron Technology, Inc.) - MonolithIC 3D Inc. - STATS ChipPAC Ltd. - Taiwan Semiconductor Manufacturing Company, Ltd. - Tezzaron Semiconductor Corporation - The 3M Company - United Microelectronics Corporation - XILINX, Inc. - Ziptronix, Inc. For more information visit http://www.researchandmarkets.com/research/35...ics_market
Synopsys, Realtek and UMC Collaborate on Industry's First Single-Chip Ultra High Definition Smart TV SoC
PR Newswire - Wed Feb 12, 8:00AM CST
Highlights:
UMC Reports Sales for January 2014
PR Newswire - Mon Feb 10, 12:37AM CST
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC" , today reported unaudited net sales for the month of January 2014
UMC's Taiwan Fabs Gain MOE Cleaner Production Certification
PR Newswire - Wed Feb 05, 4:00AM CST
United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC" , announced today that all eight of its Taiwan-based fabs have passed the Cleaner Production Assessment Method Evaluation conducted by the Industrial Development Bureau (IDB) of the Ministry of Economic Affairs (MOE). With this certification, UMC becomes the only semiconductor manufacturer in Taiwan to obtain cleaner production certification for all its local manufacturing facilities. Fabs 8A and 12A earned the Green Factory Mark in November 2012, while Fabs 6A, 8C, 8D, 8E, 8F, and 8S recently followed with their own green certifications.
Trades Under $10: 5 Low-Priced Names to Trade for Gains
at The Street - Tue Feb 04, 8:18AM CST
As the market sleeps off its hangover after a pretty nasty session yesterday, there are some big trades to be made in the smallest stocks.
EVENT: Codwell Elementary Hosts Curriculum Carnival to Celebrate National School Choice Week - January 29
PR Newswire - Tue Jan 28, 7:35AM CST
Students, parents, teachers and community organizations will celebrate National School Choice Week at John E. Codwell Elementary School with a Curriculum Carnival. Representatives from NASA, The Houston Public Library, The Boys and Girls Club and other local businesses and organizations will come together with Codwell students and staff to celebrate educational options. The event will be just one of 5,500+ independently-planned ones taking place during National School Choice Week 2014 - the nation's largest-ever celebration of educational opportunity.
UMC Receives Best Supplier Award from Lantiq for Second Straight Year
PR Newswire - Mon Jan 27, 4:00AM CST
United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC" , a leading global semiconductor foundry, today announced that it has received the "Best Supplier Award" from Lantiq for 2013. This is the second straight year that UMC has been awarded this honor. Lantiq presents this award annually to one selected supplier for their contributions to the company's success. The award was presented to UMC's CEO Mr. Po Wen Yen by Lantiq's COO Mr. Dominik Bilo.
UMC Reports Fourth Quarter 2013 Results
PR Newswire - Fri Jan 24, 5:17AM CST
Fourth Quarter 2013 Overview[1]:
New 28nm Product Platform Helps Spring Xilinx Sales
at Investor's Business Daily - Thu Jan 23, 3:33PM CST
Xilinx (XLNX), a specialist in complex programmable semiconductor chips, has engineered a positive turnaround. On Tuesday, the San Jose, Calif.-based firm said fiscal third-quarter sales jumped 15% vs. a year ago to $586.8 million. That marked the...
Global Markets and Technologies for Advanced Drug Delivery Systems
PR Newswire - Thu Jan 23, 6:29AM CST
Reportlinker.com announces that a new market research report is available in its catalogue:
United Microelectronics Corporation to Report Fourth Quarter 2013 Financial Results on January 24, 2014 US Time
GlobeNewswire - Fri Jan 17, 3:00AM CST
United Microelectronics Corporation (NYSE:UMC) (TWSE:2303), a leading independent semiconductor foundry, will hold its quarterly conference call to discuss fourth quarter 2013 results on Friday, January 24, 2014, at 4:00 a.m. US Eastern Time.
Call for Nominations: Raytheon to award grants to math teachers nationwide to support STEM education
PR Newswire - Wed Jan 15, 7:00AM CST
Raytheon Company (NYSE: RTN) will recognize middle and high school math teachers across the country for their commitment to science, technology, engineering and math (STEM) education through grants to support their work in the classroom.
UMC Reports Sales for December 2013
PR Newswire - Thu Jan 09, 12:45AM CST
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC" , today reported unaudited net sales for the month of December 2013.
Techno Source And KD Interactive Introduce The Kurio 7x 4G LTE Kids' Tablet On The Verizon Wireless Network
PR Newswire - Tue Jan 07, 12:23PM CST
Techno Source, a division of LF Products (a Li & Fung company), and KD Interactive, a division of KD Group, makers of the best-selling Kurio line of Android devices for families with kids, announce the Kurio 7x 4G LTE, the kids' tablet with wireless WAN. Running exclusively on the Verizon Wireless network, the new 7"Android 4.2 (Jellybean) Kurio 7x 4G LTE tablet will provide families with high speed wireless freedom, allowing kids to stay connected on the go with America's largest 4G LTE network.
United Microelectronics Corporation to Report First Quarter 2014 Financial Results on April 30, 2014 US Time
GlobeNewswire - Wed Apr 16, 4:00AM CDT
United Microelectronics Corporation (NYSE:UMC) (TWSE:2303), a leading independent semiconductor foundry, will hold its quarterly conference call to discuss first quarter 2014 results on Wednesday, April 30, 2014, at 5:00 a.m. US Eastern Time.
Information Technology Equities Technical Commentary -- Research on LivePerson, ModusLink Global Solutions, Fiserv, and United Microelectronics
PR Newswire - Thu Apr 10, 11:30AM CDT
On Wednesday, April 09, 2014, the NASDAQ Composite ended at 4,183.90, up 1.72%, the Dow Jones Industrial Average finished 1.11% higher at 16,437.18, and the S&P 500 closed at 1,872.18, up 1.09%. The gains were broad based as eight out of ten sectors finished on a higher note. The S&P 500 Information Technology Sector Index gained 1.56% to finish the day at 596.87, and the same has gained 3.33% in the previous three months. Investor-Edge has initiated coverage on the following equities: LivePerson Inc. (NASDAQ: LPSN), ModusLink Global Solutions Inc. (NASDAQ: MLNK), Fiserv Inc. (NASDAQ: FISV) and United Microelectronics Corp. (NYSE: UMC). Free technical research on LPSN, MLNK, FISV and UMC can be downloaded upon signing up at:
UMC Reports Sales for March 2014
PR Newswire - Wed Apr 09, 2:12AM CDT
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"
, today reported unaudited net sales for the month of March 2014. 3D Transistor Trends 2014 - The Next-Generation Transistors
M2 - Wed Mar 19, 9:59AM CDT
Research and Markets (http://www.researchandmarkets.com/research/h8nwdv/3d_transistor) has announced the addition of the "3D Transistor Trends" report to their offering. The report projects that 3D Transistors is set to become the norm as a 3D transistor is an advanced transistor that is manufactured by using nano wires in comparison to traditional usage of silicon. The development of 3D Transistors is likely to change the dynamics of semiconductor manufacturing industry. The manufacturing process of 3D transistors involves a top-down method, wherein components of the transistor are etched on the transistor's base. The nano wires, made of iridium, gallium as well as arsenide semiconductors, are layered with a thinner dielectric made of lanthanum aluminate for performing the gate operation efficiently with reduced voltage requirements. Key Topics Covered: 1. 3D TRANSISTORS - AN OVERVIEW - Transistors - An Introduction - 3D Transistors - The Next-Generation Transistors - 3D Transistors Vs. 2D Transistors - 3D Transistors - Advantages - Future Developments - 3D Chips - Applying 3D Transistors to Improve Performance of Future Electronic Devices - Stacking Techniques - 3D Chips-Major Challenges to Overcome - Recent 3D Chip-based Developmental Activities - TSMC to Challenge Intel's Leadership in Advanced Semiconductor Manufacturing Technology 2. END-USE APPLICATIONS - 3D-Enabled Smartphones - Media Tablets - Ultrabooks - Netbooks 3. RECENT INDUSTRY ACTIVITY - Altera and Intel Enter into Partnership - Synopsys and Samsung Announce Tapeout of First 14-nanometer FinFET-based Test Chip - TSMC Partners with ASML - United Microelectronics and IBM Technology Ink Agreement - Soitec and SEMATECH Enter into Partnership 4. PRODUCT LAUNCHES/INNOVATIONS - IEMN and LAAS-CNRS Develop 3D Nanometric Transistor - Synopsys Unveils Comprehensive Solution of EDA IP and Tools - Intel Unveils Range of Quad-Core 3rd Generation Processors - Globalfoundries Unveils 14-nanometer eXtreme Mobility Process - Intel Unveils Xeon Server Processors - Intel Introduces Tri-Gate 3D Transistor - Intel Unveils Silvermont Atom Chip Architecture 5. MARKET PARTICIPANTS - Globalfoundries, Inc. (USA) - Intel Corporation (USA) - Laboratoire D'analyse ET D'architecture Des Syst?mes (LAAS- CNRS) (France) - National Institute of Advanced Industrial Science and Technology (AIST) (Japan) - Samsung Semiconductor, Inc. (USA) - Soitec SA (France) - Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) (Taiwan) - Unisantis Electronics (Japan) Ltd. (Japan) 6. APPENDIX For more information visit http://www.researchandmarkets.com/research/h8...transistor
Concise Analysis of the International Semiconductor Foundry Market - Forecasts to 2016
M2 - Thu Mar 13, 5:11AM CDT
Research and Markets (http://www.researchandmarkets.com/research/w52z32/global) has announced the addition of the "Concise Analysis of the International Semiconductor Foundry Market - Forecasts to 2016" report to their offering. The Global Semiconductor Foundry market is witnessing an increasing consolidation and strategic alliances between market players, which are expected to continue even in the future. Both existing vendors and new entrants prefer the acquisitive route to either enter the market or broaden their portfolio of offerings. For instance, Hua Hong NEC Electronics and Grace Semiconductor Manufacturing Corp. completed their merger in 2011. In addition, IBM, Global Foundries, and Samsung Electronics Co. Ltd. have formed an alliance in the market. Since the market is highly fragmented and competitive, players are adopting strategies such as alliances, agreements, and mergers to sustain the competition. According to the report, one of the main drivers is the restocking of inventory by customers. As the demand for semiconductor devices is increasing, customers are replenishing the stock to keep pace with the current as well as near-future market conditions. For the past few years, this has been one of the major contributing factors to the growth of the market. Further, the report states that one of the major challenges in this market is the fluctuating revenue of the Semiconductor industry. The major reason for this fluctuating revenue is the fluctuating demand for the products in this industry. Key Topics Covered: 1. Executive Summary 2. List of Abbreviations 3. Introduction 4. Market Research Methodology 5. Scope of the Report 6. Market Landscape 7. Geographical Segmentation 8. Key Leading Countries 9. Vendor Landscape 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Key Vendor Analysis 17. Other Reports in this Series Companies Mentioned: - Apple Inc. - Dongbu HiTek Co. Ltd. - GlobalFoundries Inc. - IBM Microelectronics - Magnachip Semiconductor Corp. - Powerchip Technology Corp. - Samsung Semiconductor Inc. - Semiconductor Manufacturing International Corp. - Taiwan Semiconductor Manufacturing Co. Ltd. - Tower Semiconductor Ltd. (TowerJazz) - United Microelectronics Corp. - Vanguard International Semiconductor Corp - WIN Semiconductors Corp (GaAs) For more information visit http://www.researchandmarkets.com/research/w52z32/global
UMC Reports Sales for February 2014
PR Newswire - Mon Mar 10, 1:44AM CDT
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"
, today reported unaudited net sales for the month of February 2014. Global 3D ICs Market to 2019: MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED
M2 - Thu Feb 20, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/35kchv/3d_ics_market) has announced the addition of the "3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" report to their offering. The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide. This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019. The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments. Scope End-Use Sectors - Consumer electronics - Information and communication technology - Transport (automotive and aerospace) - Military - Others (Biomedical applications and R&D) Substrate Type: - Silicon on insulator(SOI) - Bulk Silicon Fabrication Process: - Beam re-crystallization - Wafer bonding - Silicon epitaxial growth - Solid phase crystallization Product - MEMS and Sensor - RF SiP - Optoelectronics and imaging - Memories (3D Stacks) - Logic (3D Sip/Soc) - HB LED Key Topics Covered: Chapter 1 Preface Chapter 2 Executive Summary Chapter 3 3D ICs Market Overview Chapter 4 Global 3D ICs Market, by End-Use Industry Chapter 5 Global 3D ICs Market, by Substrate Type Chapter 6 Global 3D ICs Market, by Fabrication Process Chapter 7 Global 3D ICs Market, by Product Chapter 8 Global 3D ICs Market, by Geography Chapter 9 Company Profiles - Elpida Memory, Inc. (Micron Technology, Inc.) - MonolithIC 3D Inc. - STATS ChipPAC Ltd. - Taiwan Semiconductor Manufacturing Company, Ltd. - Tezzaron Semiconductor Corporation - The 3M Company - United Microelectronics Corporation - XILINX, Inc. - Ziptronix, Inc. For more information visit http://www.researchandmarkets.com/research/35...ics_market
Synopsys, Realtek and UMC Collaborate on Industry's First Single-Chip Ultra High Definition Smart TV SoC
PR Newswire - Wed Feb 12, 8:00AM CST
Highlights:
UMC Reports Sales for January 2014
PR Newswire - Mon Feb 10, 12:37AM CST
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"
, today reported unaudited net sales for the month of January 2014 UMC's Taiwan Fabs Gain MOE Cleaner Production Certification
PR Newswire - Wed Feb 05, 4:00AM CST
United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"
, announced today that all eight of its Taiwan-based fabs have passed the Cleaner Production Assessment Method Evaluation conducted by the Industrial Development Bureau (IDB) of the Ministry of Economic Affairs (MOE). With this certification, UMC becomes the only semiconductor manufacturer in Taiwan to obtain cleaner production certification for all its local manufacturing facilities. Fabs 8A and 12A earned the Green Factory Mark in November 2012, while Fabs 6A, 8C, 8D, 8E, 8F, and 8S recently followed with their own green certifications. Trades Under $10: 5 Low-Priced Names to Trade for Gains
at The Street - Tue Feb 04, 8:18AM CST
As the market sleeps off its hangover after a pretty nasty session yesterday, there are some big trades to be made in the smallest stocks.
EVENT: Codwell Elementary Hosts Curriculum Carnival to Celebrate National School Choice Week - January 29
PR Newswire - Tue Jan 28, 7:35AM CST
Students, parents, teachers and community organizations will celebrate National School Choice Week at John E. Codwell Elementary School with a Curriculum Carnival. Representatives from NASA, The Houston Public Library, The Boys and Girls Club and other local businesses and organizations will come together with Codwell students and staff to celebrate educational options. The event will be just one of 5,500+ independently-planned ones taking place during National School Choice Week 2014 - the nation's largest-ever celebration of educational opportunity.
UMC Receives Best Supplier Award from Lantiq for Second Straight Year
PR Newswire - Mon Jan 27, 4:00AM CST
United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"
, a leading global semiconductor foundry, today announced that it has received the "Best Supplier Award" from Lantiq for 2013. This is the second straight year that UMC has been awarded this honor. Lantiq presents this award annually to one selected supplier for their contributions to the company's success. The award was presented to UMC's CEO Mr. Po Wen Yen by Lantiq's COO Mr. Dominik Bilo. UMC Reports Fourth Quarter 2013 Results
PR Newswire - Fri Jan 24, 5:17AM CST
Fourth Quarter 2013 Overview[1]:
New 28nm Product Platform Helps Spring Xilinx Sales
at Investor's Business Daily - Thu Jan 23, 3:33PM CST
Xilinx (XLNX), a specialist in complex programmable semiconductor chips, has engineered a positive turnaround. On Tuesday, the San Jose, Calif.-based firm said fiscal third-quarter sales jumped 15% vs. a year ago to $586.8 million. That marked the...
Global Markets and Technologies for Advanced Drug Delivery Systems
PR Newswire - Thu Jan 23, 6:29AM CST
Reportlinker.com announces that a new market research report is available in its catalogue:
United Microelectronics Corporation to Report Fourth Quarter 2013 Financial Results on January 24, 2014 US Time
GlobeNewswire - Fri Jan 17, 3:00AM CST
United Microelectronics Corporation (NYSE:UMC) (TWSE:2303), a leading independent semiconductor foundry, will hold its quarterly conference call to discuss fourth quarter 2013 results on Friday, January 24, 2014, at 4:00 a.m. US Eastern Time.
Call for Nominations: Raytheon to award grants to math teachers nationwide to support STEM education
PR Newswire - Wed Jan 15, 7:00AM CST
Raytheon Company (NYSE: RTN) will recognize middle and high school math teachers across the country for their commitment to science, technology, engineering and math (STEM) education through grants to support their work in the classroom.
UMC Reports Sales for December 2013
PR Newswire - Thu Jan 09, 12:45AM CST
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"
, today reported unaudited net sales for the month of December 2013. Techno Source And KD Interactive Introduce The Kurio 7x 4G LTE Kids' Tablet On The Verizon Wireless Network
PR Newswire - Tue Jan 07, 12:23PM CST
Techno Source, a division of LF Products (a Li & Fung company), and KD Interactive, a division of KD Group, makers of the best-selling Kurio line of Android devices for families with kids, announce the Kurio 7x 4G LTE, the kids' tablet with wireless WAN. Running exclusively on the Verizon Wireless network, the new 7"Android 4.2 (Jellybean) Kurio 7x 4G LTE tablet will provide families with high speed wireless freedom, allowing kids to stay connected on the go with America's largest 4G LTE network.
