Siliconware Precision Industries Company Ltd (SPIL) 6.96 $SPIL
Siliconware Precision Industries Has Returned 18.7% Since SmarTrend Recommendation (SPIL)
Comtex SmarTrend(R) - Tue Apr 15, 9:19AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 18.73% as of today's recent price of $6.94.
Shares of SPIL Up 16.3% Since Uptrend Call on Shares
Comtex SmarTrend(R) - Mon Apr 07, 5:10PM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 16.34% as of today's recent price of $6.80.
Flip-Chip Trends - Global Market Overview 2014
M2 - Fri Apr 04, 9:33AM CDT
Research and Markets (http://www.researchandmarkets.com/research/6mk695/flipchip_trends) has announced the addition of the "Flip-Chip Trends" report to their offering. Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods. The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide are profiled, including - Amkor Technology Inc. - FlipChip International LLC - Kyocera America Inc. - NTK Technologies Inc. - Philips Lumileds Lighting Company - Signetics Corporation - STATS ChipPAC Ltd. - STMicroelectronics NV - Tessera Technologies Inc. - Toshiba Electronics Europe GmbH Key Topics Covered: 1. FLIP-CHIP - AN OVERVIEW - A Prelude - Flip-Chip - Enabling Compact, Smart Devices - Flip-Chip - Applications - Advantages of Flip-Chip Technique - High Packaging Density - High Performance - Ruggedness - Cost-efficiency - Flip-Chips Package Design - Manufacturing of Flip-Chip Assemblies 2. MARKET TRENDS - Flip-Chip Technique Extends to New Applications - Table 1: Global Flip Chip Market (2012-2017) in US$ Million - Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications - Latest Chip Interconnection Techniques Drive Flip-Chip Adoption - WLP Gradually Replaces Flip-Chips in Compact Products 3. RECENT INDUSTRY ACTIVITY - FlipChip International Inks Partnership Agreement with EZconn Czech - Philips Lumileds Introduces LUXEON Flip Chip LEDs - Altera Selects FCmBGA Packaging Solution of Amkor Technology - FlipChip International Takes Over Millennium Microtech Holdings - FlipChip International Forms Joint Venture with Millennium Microtech - Kyocera America Sets Up New Clean Room - Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process - Signetics to Expand Flip-Chip Package Assembly Capacity - STATS ChipPAC Introduces fcCuBE Flip-Chip Packaging Technology - Philips Lumileds Unveils LUXEON Rebel LEDs - STATS ChipPAC Launches LCFC Technology with Copper Column Bump - Tessera Inks Licensing Agreement with Nanium - Zicom Group Purchases Controlling Stake in Orion Systems Integration 4. MARKET PARTICIPANTS - Amkor Technology, Inc. (USA) - ASE Group (Taiwan) - ASE Kaohsiung (Taiwan) - Belton Technology Group (China) - Faraday Technology Corporation (Taiwan) - FlipChip International LLC (USA) - GigOptix, Inc. (USA) - Ibiden Co., Ltd. (Japan) - Kyocera America, Inc. (USA) - LSI Corporation (USA) - Nanium (Portugal) - NTK Technologies, Inc. (USA) - Philips Lumileds Lighting Company (USA) - Reflex Photonics, Inc. (Canada) - Renesas Electronics America, Inc. (USA) - Shinko Electric Industries Co., Ltd. (Japan) - Signetics Corporation (South Korea) - Siliconware Precision Industries Co., Ltd. (Taiwan) - STATS ChipPAC Ltd. (Singapore) - STMicroelectronics NV (Switzerland) - Tektronix Component Solutions (USA) - Tessera Technologies, Inc. (USA) - Tokyo Electron Ltd. (Japan) - Toshiba Electronics Europe GmbH (Germany) - Toshiba Semiconductor & Storage Products (Japan) - Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia) - UTAC Holdings Ltd. (UTAC Group) (Singapore) - Valtronic Technologies (Suisse) SA (Switzerland) 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/6m...hip_trends
Upgrade Alert for Siliconware Precision Industries (SPIL)
Comtex SmarTrend(R) - Fri Apr 04, 6:58AM CDT
Siliconware Precision Industries (NASDAQ:SPIL) was upgraded from Hold to Buy at Societe Generale today. The stock closed yesterday at $6.93 on volume of 661,000 shares, below average daily volume of 748,000. In the past 52 weeks, Siliconware Precision Industries share prices have been bracketed by a low of $5.11 and a high of $7.10 and closed yesterday at $6.92, 35% above that low price. The 200-day and 50-day moving averages have moved 0.31% higher and 0.87% higher over the past week, respectively.
Pre-Market Scans on Equities Hitting New Highs -- Research on VMware, Northrop Grumman, Retrophin, and Siliconware Precision Industries
PR Newswire - Thu Apr 03, 7:22AM CDT
On Wednesday, April 02, 2014, the NASDAQ Composite finished at 4,276.46, up 0.20%. The Dow Jones Industrial Average closed the session at 16,573.00, up 0.24% and the S&P 500 ended the day at 1,890.90, higher by 0.29%. The gains were broad based with eight out of ten sectors ending the session in positive. Investor-Edge looks at some of the equities that hit a new 52-week high during the last session. These include VMware Inc. (NYSE: VMW), Northrop Grumman Corp. (NYSE: NOC), Retrophin Inc. (NASDAQ: RTRX) and Siliconware Precision Industries Co. (NASDAQ: SPIL). Free technical research on VMW, NOC, RTRX and SPIL can be downloaded upon signing up at:
14.2% Return Seen to Date on SmarTrend Siliconware Precision Industries Call (SPIL)
Comtex SmarTrend(R) - Mon Mar 31, 11:17AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 14.20% as of today's recent price of $6.68.
LCD Driver IC Trends 2014 Report
M2 - Fri Mar 28, 4:11AM CDT
Research and Markets (http://www.researchandmarkets.com/research/ff2sl5/lcd_driver_ic) has announced the addition of the "LCD Driver IC Trends" report to their offering. The Liquid Crystal Display (LCD) driver system includes row drivers, a reference source, a timing controller, and column drivers, wherein the column drivers enable a superior quality display. The report analyzes and presents an overview of LCD Driver ICs market worldwide. The report in addition provides global market estimates and projections in units for years 2012 through 2017, for end use applications including TV, Flat Panel Monitors, Notebooks, Tablets, Handsets, and Smartphones. Supported with 2 market data tables, the report provides a review of market trends, potential end use markets including Tablets and Smartphones, and trends in the Asian market. The report highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 44 companies operating in the LCD Driver ICs arena worldwide are profiled, including - Atmel - Best Electronics - DenMOS Technology - Epson Electronics America - ILI Technology - LAPIS Semiconductor - MagnaChip Semiconductor - NXP Semiconductors - Realtek Semiconductor - Siliconware Precision Industries Key Topics Covered 1. LCD DRIVER ICS - ENABLING QUALITY DISPLAY 2. ASIAN MARKET TRENDS Taiwan-Based LCD Driver IC Design Houses Shift to Japan and South Korea Packaging and Testing Companies LCD Driver IC Design Houses to Transition to 12-Inch Processes in Future LCD Driver IC Market Witnesses Short Supply 3. RECENT INDUSTRY ACTIVITY NXP Launches LPC11D00 and LPC12D00 MCU Series with Integrated LCD Drivers Siliconware Precision Industries Inks Agreement with ChipMOS Technologies 4. MARKET PARTICIPANTS 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/ff..._driver_ic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Uptrend Call Working As Siliconware Precision Industries Stock Rises 13.4% (SPIL)
Comtex SmarTrend(R) - Mon Mar 24, 10:05AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 13.43% as of today's recent price of $6.63.
Downgrade Alert for Siliconware Precision Industries (SPIL)
Comtex SmarTrend(R) - Tue Mar 18, 6:58AM CDT
Siliconware Precision Industries (NASDAQ:SPIL) was downgraded from Buy to Hold at Deutsche Bank today. The stock closed yesterday at $6.71 on volume of 774,000 shares, above average daily volume of 698,000. Siliconware Precision Industries share prices have moved between a 52-week high of $7.02 and a 52-week low of $5.11 and closed yesterday at 31% above that low price at $6.71 per share. Over the last five market days, the 200-day moving average (MA) has gone up 0.3% while the 50-day MA has advanced 0.8%.
Siliconware (SPIL) Enters Overbought Territory - Tale of the Tape
Zacks Equity Research - Zacks Investment Research - Thu Mar 13, 8:35AM CDT
Siliconware (SPIL) Enters Overbought Territory
Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016
M2 - Thu Mar 13, 5:05AM CDT
Research and Markets (http://www.researchandmarkets.com/research/sbbp8g/global) has announced the addition of the "Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016" report to their offering. One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. Key Topics Covered: 1. Executive Summary 2. List of Abbreviations 3. Introduction 4. Market Research Methodology 5. Scope of the Report 6. Market Landscape 7. Geographical Segmentation 8. Vendor Landscape 9. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis Companies Mentioned: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. - Atmel Corp. - Broadcom Corp. - Cambridge Silicon Radio Ltd. - ChipMOS Technologies Ltd. - Freescale Semiconductor Inc. - JCET-ChangJiang Elec. Tech. - J-Devices Corp. - Powertech Technology Inc. - Qualcomm Inc. - United Test and Assembly Center Ltd. (UTAC). For more information visit http://www.researchandmarkets.com/research/sbbp8g/global
Leading Canadian Biosolids Solution Provider Coming To North Battleford
GlobeNewswire - Thu Jan 30, 2:42PM CST
The City of North Battleford, Saskatchewan has formally approved plans to bring world-class biosolids solution provider, Lystek International to the community, reducing local landfill pressures and producing a federally registered fertilizer product to benefit agriculture.
Siliconware Precision Industries Reports a 1.3% Quarter-over-Quarter Decline in Revenues Resulting in Earnings per Share of NT$ 0.72 or Earnings per ADS of US$ 0.12 for Fourth Quarter 2013
PR Newswire - Sun Jan 26, 11:35PM CST
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company"
(Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the fourth quarter of 2013 were NT$ 18,844 million, which represented a 1.3% decline in revenues compared to the third quarter of 2013 and a 16.7% growth in revenues compared to the fourth quarter of 2012. SPIL reported a net income of NT$ 2,260 million for the fourth quarter of 2013, compared with a net income of NT$ 2,184 million and a net income of NT$ 1,590 million for the third quarter of 2013 and the fourth quarter of 2012, respectively.
Cost Benefits Drive the Market for Outsourced Semiconductor Assembly and Test (OSAT), According to a New Trend Report Published by Global Industry Analysts, Inc.
PRWeb - Tue Jan 07, 9:51AM CST
Follow us on LinkedIn - Semiconductor assembly involves a process of electrically and mechanically connecting a completely-processed circuit chip/semiconductor device to the package. The Outsourced Semiconductor Assembly and Test (OSAT) market is expected to witness growth driven by the increase in packaging costs and a rapid transformation towards the adoption of outsourcing model. Growing demand for assembly and test equipment and packaging materials from Southeast Asia is also expected to augur well for the global OSAT market. Increasing sophistication and complexity of modern electronics is creating a parallel need for advanced and customized packaging solutions, which in turn requires innovative assembly manufacturing processes. Poised to benefit against this backdrop are OSAT service providers.
Market Research Scanner:Teradyne, Lam Research, and Siliconware Precision Industries
PR Newswire - Fri Dec 27, 7:00AM CST
On Thursday, December 26, 2013, the U.S. equity market edged higher. The S&P 500 ended the day at 1,842.02, up 0.47%; the Dow Jones Industrial Average closed at 16,479.88, up 0.75%; and the NASDAQ Composite Index finished at 4,167.18, up 0.28%. The S&P 500 Information Technology Sector Index edged 0.30% higher to close the session at 583.08; and the S&P 500 Semiconductors & Semiconductor Equipment Industry Index finished at 418.83, up 0.46%. The S&P 500 Semiconductors & Semiconductor Equipment Industry Index has gained 1.63% in the previous three trading sessions and 5.58% in the last one month, outperforming the S&P 500, which has gained 1.30% and 2.19% during the respective periods. The major movers in the information technology sector included Teradyne Inc. (NYSE: TER), Lam Research Corp. (NASDAQ: LRCX) and Siliconware Precision Industries Co. (NASDAQ: SPIL). All these companies are tracked by AAAResearchReports.com. Free technical research on TER, LRCX, and SPIL can be downloaded upon signing up at:
Global 3D Semiconductor Packaging Market 2013 Report
M2 - Wed Nov 20, 3:23AM CST
Research and Markets (http://www.researchandmarkets.com/research/rngx9x/global_3d) has announced the addition of the Global 3D Semiconductor Packaging Market 2013 Report to their offering. Global 3D Semiconductor Packaging Market Expected To Grow At A CAGR Of 58.1 Percent Over The Period 2012-2016 The report provides an in-depth market analysis with inputs from industry experts. Commenting on the report, an analyst from the researchers' Hardware team said: ''The semiconductor packaging companies are expected to have large packaging capacities as a primary criterion to receive orders from the semiconductor chip manufacturers. The semiconductor chip manufacturers tend to prefer to outsource their packaging to one capable and reliable vendor rather than to a number of vendors. As a result, the players in this market are increasing their capacity in terms of machinery as well as staffing levels to cope with the demand from their customers'' According to the report, the Global 3D Semiconductor Packaging market has several factors driving the market. The key growth factor is the need to reduce the rising costs involved in designing a compact device with significant power efficiency. In order to design and manufacture such a device, the players in the Global Semiconductor market are focusing more on 3D semiconductor packaging. Further, the key challenge hindering growth is the cyclical nature of the Global Semiconductor market, which is leading to fluctuating demand and revenue for these vendors. Key Topics Covered 1. Executive Summary 2. Introduction 3. Market Coverage 4. Market Landscape 5. Geographical Segmentation 6. Key Leading Countries 7. Vendor Landscape 8. Buying Criteria 9. Market Growth Drivers 10. Drivers and their Impact 11. Market Challenges 12. Impact of Drivers and Challenges 13. Market Trends 14. Key Vendor Analysis Companies Mentioned - Advanced Semiconductor Engineering - Amkor Technology - Powertech Technology - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/rngx9x/global_3d About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Pre-Market Review: Teradyne Inc., Lam Research Corp., Siliconware Precision Industries Co., and Mindspeed Technologies Inc.
PR Newswire - Wed Nov 06, 2:56PM CST
Editor Note: For more information about this release, please scroll to bottom.
IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition
M2 - Fri Nov 01, 6:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/zjjjxm/ic_package_pitch) has announced the addition of the "IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition" report to their offering. Integrated circuits (ICs) are placed in a package, which gives the semiconductor die the mechanical and electrical interface to the printed circuit board (PCB). Once packaged, the IC transforms from a 'die' into a 'chip'. This 'IC Package Pitch, Leadframe Plating, And Substrate Markets' report, provides information which will help determine the size of a package, the test socket size, and the footprint of the device on a PCB, as well as provide information on material choices for leadframes, which affects the test companies, printed circuit board manufacturers, and others who delve into the interfaces with the package leadframe. Key Topics Covered 1: Introduction 2: Executive Summary 3: State of the Industry - Economic Overview - Industry Overview 4: Forecasts by IC Package Pitch, by Package Family and by I/O count, 2012 - 2017 Package Type - DIP - SOT - SO - TSOP - FN - CC - QFP - QFN - PGA - BGA - FBGA - WLP 5: IC Package Leadframe and Lead-free Issues - Preplate - Post plate - Lead-free Issues: Tin Whiskers - New Product Introductions -- Lockheed Martin Space Systems Company - Forecasts of the various plating options including Matte Tin, Tin Silver, Tin Copper, Tin Bismuth, Nickel Palladium, and Nickel Palladium Gold 6: IC Package Substrates - Ceramic - Laminate - HDIS - Coreless - Flex Tape - Embedded - Thermal Substrates - Forecasts by Pitch, Units, Area, and Revenue - New Product Introductions -- Fujitsu Components America -- Intel Corporation -- Shinko Electric Industries -- Siliconware Precision Industries Substrates are forecast by material type by package, and standardized for forecasting substrate area. The substrate revenue is also provided. Appendix A: Web Address Guide Appendix B: Glossary of Terms List of Tables and Figures Companies Mentioned - Fujitsu Components America - Intel Corporation - Shinko Electric Industries - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/zj...kage_pitch About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Siliconware Precision Industries Has Returned 18.7% Since SmarTrend Recommendation (SPIL)
Comtex SmarTrend(R) - Tue Apr 15, 9:19AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 18.73% as of today's recent price of $6.94.
Shares of SPIL Up 16.3% Since Uptrend Call on Shares
Comtex SmarTrend(R) - Mon Apr 07, 5:10PM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 16.34% as of today's recent price of $6.80.
Flip-Chip Trends - Global Market Overview 2014
M2 - Fri Apr 04, 9:33AM CDT
Research and Markets (http://www.researchandmarkets.com/research/6mk695/flipchip_trends) has announced the addition of the "Flip-Chip Trends" report to their offering. Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods. The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide are profiled, including - Amkor Technology Inc. - FlipChip International LLC - Kyocera America Inc. - NTK Technologies Inc. - Philips Lumileds Lighting Company - Signetics Corporation - STATS ChipPAC Ltd. - STMicroelectronics NV - Tessera Technologies Inc. - Toshiba Electronics Europe GmbH Key Topics Covered: 1. FLIP-CHIP - AN OVERVIEW - A Prelude - Flip-Chip - Enabling Compact, Smart Devices - Flip-Chip - Applications - Advantages of Flip-Chip Technique - High Packaging Density - High Performance - Ruggedness - Cost-efficiency - Flip-Chips Package Design - Manufacturing of Flip-Chip Assemblies 2. MARKET TRENDS - Flip-Chip Technique Extends to New Applications - Table 1: Global Flip Chip Market (2012-2017) in US$ Million - Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications - Latest Chip Interconnection Techniques Drive Flip-Chip Adoption - WLP Gradually Replaces Flip-Chips in Compact Products 3. RECENT INDUSTRY ACTIVITY - FlipChip International Inks Partnership Agreement with EZconn Czech - Philips Lumileds Introduces LUXEON Flip Chip LEDs - Altera Selects FCmBGA Packaging Solution of Amkor Technology - FlipChip International Takes Over Millennium Microtech Holdings - FlipChip International Forms Joint Venture with Millennium Microtech - Kyocera America Sets Up New Clean Room - Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process - Signetics to Expand Flip-Chip Package Assembly Capacity - STATS ChipPAC Introduces fcCuBE Flip-Chip Packaging Technology - Philips Lumileds Unveils LUXEON Rebel LEDs - STATS ChipPAC Launches LCFC Technology with Copper Column Bump - Tessera Inks Licensing Agreement with Nanium - Zicom Group Purchases Controlling Stake in Orion Systems Integration 4. MARKET PARTICIPANTS - Amkor Technology, Inc. (USA) - ASE Group (Taiwan) - ASE Kaohsiung (Taiwan) - Belton Technology Group (China) - Faraday Technology Corporation (Taiwan) - FlipChip International LLC (USA) - GigOptix, Inc. (USA) - Ibiden Co., Ltd. (Japan) - Kyocera America, Inc. (USA) - LSI Corporation (USA) - Nanium (Portugal) - NTK Technologies, Inc. (USA) - Philips Lumileds Lighting Company (USA) - Reflex Photonics, Inc. (Canada) - Renesas Electronics America, Inc. (USA) - Shinko Electric Industries Co., Ltd. (Japan) - Signetics Corporation (South Korea) - Siliconware Precision Industries Co., Ltd. (Taiwan) - STATS ChipPAC Ltd. (Singapore) - STMicroelectronics NV (Switzerland) - Tektronix Component Solutions (USA) - Tessera Technologies, Inc. (USA) - Tokyo Electron Ltd. (Japan) - Toshiba Electronics Europe GmbH (Germany) - Toshiba Semiconductor & Storage Products (Japan) - Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia) - UTAC Holdings Ltd. (UTAC Group) (Singapore) - Valtronic Technologies (Suisse) SA (Switzerland) 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/6m...hip_trends
Upgrade Alert for Siliconware Precision Industries (SPIL)
Comtex SmarTrend(R) - Fri Apr 04, 6:58AM CDT
Siliconware Precision Industries (NASDAQ:SPIL) was upgraded from Hold to Buy at Societe Generale today. The stock closed yesterday at $6.93 on volume of 661,000 shares, below average daily volume of 748,000. In the past 52 weeks, Siliconware Precision Industries share prices have been bracketed by a low of $5.11 and a high of $7.10 and closed yesterday at $6.92, 35% above that low price. The 200-day and 50-day moving averages have moved 0.31% higher and 0.87% higher over the past week, respectively.
Pre-Market Scans on Equities Hitting New Highs -- Research on VMware, Northrop Grumman, Retrophin, and Siliconware Precision Industries
PR Newswire - Thu Apr 03, 7:22AM CDT
On Wednesday, April 02, 2014, the NASDAQ Composite finished at 4,276.46, up 0.20%. The Dow Jones Industrial Average closed the session at 16,573.00, up 0.24% and the S&P 500 ended the day at 1,890.90, higher by 0.29%. The gains were broad based with eight out of ten sectors ending the session in positive. Investor-Edge looks at some of the equities that hit a new 52-week high during the last session. These include VMware Inc. (NYSE: VMW), Northrop Grumman Corp. (NYSE: NOC), Retrophin Inc. (NASDAQ: RTRX) and Siliconware Precision Industries Co. (NASDAQ: SPIL). Free technical research on VMW, NOC, RTRX and SPIL can be downloaded upon signing up at:
14.2% Return Seen to Date on SmarTrend Siliconware Precision Industries Call (SPIL)
Comtex SmarTrend(R) - Mon Mar 31, 11:17AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 14.20% as of today's recent price of $6.68.
LCD Driver IC Trends 2014 Report
M2 - Fri Mar 28, 4:11AM CDT
Research and Markets (http://www.researchandmarkets.com/research/ff2sl5/lcd_driver_ic) has announced the addition of the "LCD Driver IC Trends" report to their offering. The Liquid Crystal Display (LCD) driver system includes row drivers, a reference source, a timing controller, and column drivers, wherein the column drivers enable a superior quality display. The report analyzes and presents an overview of LCD Driver ICs market worldwide. The report in addition provides global market estimates and projections in units for years 2012 through 2017, for end use applications including TV, Flat Panel Monitors, Notebooks, Tablets, Handsets, and Smartphones. Supported with 2 market data tables, the report provides a review of market trends, potential end use markets including Tablets and Smartphones, and trends in the Asian market. The report highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 44 companies operating in the LCD Driver ICs arena worldwide are profiled, including - Atmel - Best Electronics - DenMOS Technology - Epson Electronics America - ILI Technology - LAPIS Semiconductor - MagnaChip Semiconductor - NXP Semiconductors - Realtek Semiconductor - Siliconware Precision Industries Key Topics Covered 1. LCD DRIVER ICS - ENABLING QUALITY DISPLAY 2. ASIAN MARKET TRENDS Taiwan-Based LCD Driver IC Design Houses Shift to Japan and South Korea Packaging and Testing Companies LCD Driver IC Design Houses to Transition to 12-Inch Processes in Future LCD Driver IC Market Witnesses Short Supply 3. RECENT INDUSTRY ACTIVITY NXP Launches LPC11D00 and LPC12D00 MCU Series with Integrated LCD Drivers Siliconware Precision Industries Inks Agreement with ChipMOS Technologies 4. MARKET PARTICIPANTS 5. APPENDIX For more information visit http://www.researchandmarkets.com/research/ff..._driver_ic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Uptrend Call Working As Siliconware Precision Industries Stock Rises 13.4% (SPIL)
Comtex SmarTrend(R) - Mon Mar 24, 10:05AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 7 months, Siliconware Precision Industries has returned 13.43% as of today's recent price of $6.63.
Downgrade Alert for Siliconware Precision Industries (SPIL)
Comtex SmarTrend(R) - Tue Mar 18, 6:58AM CDT
Siliconware Precision Industries (NASDAQ:SPIL) was downgraded from Buy to Hold at Deutsche Bank today. The stock closed yesterday at $6.71 on volume of 774,000 shares, above average daily volume of 698,000. Siliconware Precision Industries share prices have moved between a 52-week high of $7.02 and a 52-week low of $5.11 and closed yesterday at 31% above that low price at $6.71 per share. Over the last five market days, the 200-day moving average (MA) has gone up 0.3% while the 50-day MA has advanced 0.8%.
Siliconware (SPIL) Enters Overbought Territory - Tale of the Tape
Zacks Equity Research - Zacks Investment Research - Thu Mar 13, 8:35AM CDT
Siliconware (SPIL) Enters Overbought Territory
Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016
M2 - Thu Mar 13, 5:05AM CDT
Research and Markets (http://www.researchandmarkets.com/research/sbbp8g/global) has announced the addition of the "Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016" report to their offering. One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. Key Topics Covered: 1. Executive Summary 2. List of Abbreviations 3. Introduction 4. Market Research Methodology 5. Scope of the Report 6. Market Landscape 7. Geographical Segmentation 8. Vendor Landscape 9. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis Companies Mentioned: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. - Atmel Corp. - Broadcom Corp. - Cambridge Silicon Radio Ltd. - ChipMOS Technologies Ltd. - Freescale Semiconductor Inc. - JCET-ChangJiang Elec. Tech. - J-Devices Corp. - Powertech Technology Inc. - Qualcomm Inc. - United Test and Assembly Center Ltd. (UTAC). For more information visit http://www.researchandmarkets.com/research/sbbp8g/global
Leading Canadian Biosolids Solution Provider Coming To North Battleford
GlobeNewswire - Thu Jan 30, 2:42PM CST
The City of North Battleford, Saskatchewan has formally approved plans to bring world-class biosolids solution provider, Lystek International to the community, reducing local landfill pressures and producing a federally registered fertilizer product to benefit agriculture.
Siliconware Precision Industries Reports a 1.3% Quarter-over-Quarter Decline in Revenues Resulting in Earnings per Share of NT$ 0.72 or Earnings per ADS of US$ 0.12 for Fourth Quarter 2013
PR Newswire - Sun Jan 26, 11:35PM CST
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company"
(Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the fourth quarter of 2013 were NT$ 18,844 million, which represented a 1.3% decline in revenues compared to the third quarter of 2013 and a 16.7% growth in revenues compared to the fourth quarter of 2012. SPIL reported a net income of NT$ 2,260 million for the fourth quarter of 2013, compared with a net income of NT$ 2,184 million and a net income of NT$ 1,590 million for the third quarter of 2013 and the fourth quarter of 2012, respectively. Cost Benefits Drive the Market for Outsourced Semiconductor Assembly and Test (OSAT), According to a New Trend Report Published by Global Industry Analysts, Inc.
PRWeb - Tue Jan 07, 9:51AM CST
Follow us on LinkedIn - Semiconductor assembly involves a process of electrically and mechanically connecting a completely-processed circuit chip/semiconductor device to the package. The Outsourced Semiconductor Assembly and Test (OSAT) market is expected to witness growth driven by the increase in packaging costs and a rapid transformation towards the adoption of outsourcing model. Growing demand for assembly and test equipment and packaging materials from Southeast Asia is also expected to augur well for the global OSAT market. Increasing sophistication and complexity of modern electronics is creating a parallel need for advanced and customized packaging solutions, which in turn requires innovative assembly manufacturing processes. Poised to benefit against this backdrop are OSAT service providers.
Market Research Scanner:Teradyne, Lam Research, and Siliconware Precision Industries
PR Newswire - Fri Dec 27, 7:00AM CST
On Thursday, December 26, 2013, the U.S. equity market edged higher. The S&P 500 ended the day at 1,842.02, up 0.47%; the Dow Jones Industrial Average closed at 16,479.88, up 0.75%; and the NASDAQ Composite Index finished at 4,167.18, up 0.28%. The S&P 500 Information Technology Sector Index edged 0.30% higher to close the session at 583.08; and the S&P 500 Semiconductors & Semiconductor Equipment Industry Index finished at 418.83, up 0.46%. The S&P 500 Semiconductors & Semiconductor Equipment Industry Index has gained 1.63% in the previous three trading sessions and 5.58% in the last one month, outperforming the S&P 500, which has gained 1.30% and 2.19% during the respective periods. The major movers in the information technology sector included Teradyne Inc. (NYSE: TER), Lam Research Corp. (NASDAQ: LRCX) and Siliconware Precision Industries Co. (NASDAQ: SPIL). All these companies are tracked by AAAResearchReports.com. Free technical research on TER, LRCX, and SPIL can be downloaded upon signing up at:
Global 3D Semiconductor Packaging Market 2013 Report
M2 - Wed Nov 20, 3:23AM CST
Research and Markets (http://www.researchandmarkets.com/research/rngx9x/global_3d) has announced the addition of the Global 3D Semiconductor Packaging Market 2013 Report to their offering. Global 3D Semiconductor Packaging Market Expected To Grow At A CAGR Of 58.1 Percent Over The Period 2012-2016 The report provides an in-depth market analysis with inputs from industry experts. Commenting on the report, an analyst from the researchers' Hardware team said: ''The semiconductor packaging companies are expected to have large packaging capacities as a primary criterion to receive orders from the semiconductor chip manufacturers. The semiconductor chip manufacturers tend to prefer to outsource their packaging to one capable and reliable vendor rather than to a number of vendors. As a result, the players in this market are increasing their capacity in terms of machinery as well as staffing levels to cope with the demand from their customers'' According to the report, the Global 3D Semiconductor Packaging market has several factors driving the market. The key growth factor is the need to reduce the rising costs involved in designing a compact device with significant power efficiency. In order to design and manufacture such a device, the players in the Global Semiconductor market are focusing more on 3D semiconductor packaging. Further, the key challenge hindering growth is the cyclical nature of the Global Semiconductor market, which is leading to fluctuating demand and revenue for these vendors. Key Topics Covered 1. Executive Summary 2. Introduction 3. Market Coverage 4. Market Landscape 5. Geographical Segmentation 6. Key Leading Countries 7. Vendor Landscape 8. Buying Criteria 9. Market Growth Drivers 10. Drivers and their Impact 11. Market Challenges 12. Impact of Drivers and Challenges 13. Market Trends 14. Key Vendor Analysis Companies Mentioned - Advanced Semiconductor Engineering - Amkor Technology - Powertech Technology - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/rngx9x/global_3d About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Pre-Market Review: Teradyne Inc., Lam Research Corp., Siliconware Precision Industries Co., and Mindspeed Technologies Inc.
PR Newswire - Wed Nov 06, 2:56PM CST
Editor Note: For more information about this release, please scroll to bottom.
IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition
M2 - Fri Nov 01, 6:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/zjjjxm/ic_package_pitch) has announced the addition of the "IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition" report to their offering. Integrated circuits (ICs) are placed in a package, which gives the semiconductor die the mechanical and electrical interface to the printed circuit board (PCB). Once packaged, the IC transforms from a 'die' into a 'chip'. This 'IC Package Pitch, Leadframe Plating, And Substrate Markets' report, provides information which will help determine the size of a package, the test socket size, and the footprint of the device on a PCB, as well as provide information on material choices for leadframes, which affects the test companies, printed circuit board manufacturers, and others who delve into the interfaces with the package leadframe. Key Topics Covered 1: Introduction 2: Executive Summary 3: State of the Industry - Economic Overview - Industry Overview 4: Forecasts by IC Package Pitch, by Package Family and by I/O count, 2012 - 2017 Package Type - DIP - SOT - SO - TSOP - FN - CC - QFP - QFN - PGA - BGA - FBGA - WLP 5: IC Package Leadframe and Lead-free Issues - Preplate - Post plate - Lead-free Issues: Tin Whiskers - New Product Introductions -- Lockheed Martin Space Systems Company - Forecasts of the various plating options including Matte Tin, Tin Silver, Tin Copper, Tin Bismuth, Nickel Palladium, and Nickel Palladium Gold 6: IC Package Substrates - Ceramic - Laminate - HDIS - Coreless - Flex Tape - Embedded - Thermal Substrates - Forecasts by Pitch, Units, Area, and Revenue - New Product Introductions -- Fujitsu Components America -- Intel Corporation -- Shinko Electric Industries -- Siliconware Precision Industries Substrates are forecast by material type by package, and standardized for forecasting substrate area. The substrate revenue is also provided. Appendix A: Web Address Guide Appendix B: Glossary of Terms List of Tables and Figures Companies Mentioned - Fujitsu Components America - Intel Corporation - Shinko Electric Industries - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/zj...kage_pitch About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
