Latest Siliconware Precision Industries Company Ltd (SPIL) Headlines
Siliconware Precision Industries Has Returned 19.4% Since SmarTrend Recommendation (SPIL)
Comtex SmarTrend(R) - Thu Mar 13, 9:42AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 6 months, Siliconware Precision Industries has returned 19.42% as of today's recent price of $6.98.
Siliconware (SPIL) Enters Overbought Territory - Tale of the Tape
Zacks Equity Research - Zacks Investment Research - Thu Mar 13, 8:35AM CDT
Siliconware (SPIL) Enters Overbought Territory
Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016
M2 - Thu Mar 13, 5:05AM CDT
Research and Markets (http://www.researchandmarkets.com/research/sbbp8g/global) has announced the addition of the "Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016" report to their offering. One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. Key Topics Covered: 1. Executive Summary 2. List of Abbreviations 3. Introduction 4. Market Research Methodology 5. Scope of the Report 6. Market Landscape 7. Geographical Segmentation 8. Vendor Landscape 9. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis Companies Mentioned: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. - Atmel Corp. - Broadcom Corp. - Cambridge Silicon Radio Ltd. - ChipMOS Technologies Ltd. - Freescale Semiconductor Inc. - JCET-ChangJiang Elec. Tech. - J-Devices Corp. - Powertech Technology Inc. - Qualcomm Inc. - United Test and Assembly Center Ltd. (UTAC). For more information visit http://www.researchandmarkets.com/research/sbbp8g/global
Leading Canadian Biosolids Solution Provider Coming To North Battleford
GlobeNewswire - Thu Jan 30, 2:42PM CST
The City of North Battleford, Saskatchewan has formally approved plans to bring world-class biosolids solution provider, Lystek International to the community, reducing local landfill pressures and producing a federally registered fertilizer product to benefit agriculture.
Siliconware Precision Industries Reports a 1.3% Quarter-over-Quarter Decline in Revenues Resulting in Earnings per Share of NT$ 0.72 or Earnings per ADS of US$ 0.12 for Fourth Quarter 2013
PR Newswire - Sun Jan 26, 11:35PM CST
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the fourth quarter of 2013 were NT$ 18,844 million, which represented a 1.3% decline in revenues compared to the third quarter of 2013 and a 16.7% growth in revenues compared to the fourth quarter of 2012. SPIL reported a net income of NT$ 2,260 million for the fourth quarter of 2013, compared with a net income of NT$ 2,184 million and a net income of NT$ 1,590 million for the third quarter of 2013 and the fourth quarter of 2012, respectively.
Cost Benefits Drive the Market for Outsourced Semiconductor Assembly and Test (OSAT), According to a New Trend Report Published by Global Industry Analysts, Inc.
PRWeb - Tue Jan 07, 9:51AM CST
Follow us on LinkedIn - Semiconductor assembly involves a process of electrically and mechanically connecting a completely-processed circuit chip/semiconductor device to the package. The Outsourced Semiconductor Assembly and Test (OSAT) market is expected to witness growth driven by the increase in packaging costs and a rapid transformation towards the adoption of outsourcing model. Growing demand for assembly and test equipment and packaging materials from Southeast Asia is also expected to augur well for the global OSAT market. Increasing sophistication and complexity of modern electronics is creating a parallel need for advanced and customized packaging solutions, which in turn requires innovative assembly manufacturing processes. Poised to benefit against this backdrop are OSAT service providers.
Market Research Scanner:Teradyne, Lam Research, and Siliconware Precision Industries
PR Newswire - Fri Dec 27, 7:00AM CST
On Thursday, December 26, 2013, the U.S. equity market edged higher. The S&P 500 ended the day at 1,842.02, up 0.47%; the Dow Jones Industrial Average closed at 16,479.88, up 0.75%; and the NASDAQ Composite Index finished at 4,167.18, up 0.28%. The S&P 500 Information Technology Sector Index edged 0.30% higher to close the session at 583.08; and the S&P 500 Semiconductors & Semiconductor Equipment Industry Index finished at 418.83, up 0.46%. The S&P 500 Semiconductors & Semiconductor Equipment Industry Index has gained 1.63% in the previous three trading sessions and 5.58% in the last one month, outperforming the S&P 500, which has gained 1.30% and 2.19% during the respective periods. The major movers in the information technology sector included Teradyne Inc. (NYSE: TER), Lam Research Corp. (NASDAQ: LRCX) and Siliconware Precision Industries Co. (NASDAQ: SPIL). All these companies are tracked by AAAResearchReports.com. Free technical research on TER, LRCX, and SPIL can be downloaded upon signing up at:
Global 3D Semiconductor Packaging Market 2013 Report
M2 - Wed Nov 20, 3:23AM CST
Research and Markets (http://www.researchandmarkets.com/research/rngx9x/global_3d) has announced the addition of the Global 3D Semiconductor Packaging Market 2013 Report to their offering. Global 3D Semiconductor Packaging Market Expected To Grow At A CAGR Of 58.1 Percent Over The Period 2012-2016 The report provides an in-depth market analysis with inputs from industry experts. Commenting on the report, an analyst from the researchers' Hardware team said: ''The semiconductor packaging companies are expected to have large packaging capacities as a primary criterion to receive orders from the semiconductor chip manufacturers. The semiconductor chip manufacturers tend to prefer to outsource their packaging to one capable and reliable vendor rather than to a number of vendors. As a result, the players in this market are increasing their capacity in terms of machinery as well as staffing levels to cope with the demand from their customers'' According to the report, the Global 3D Semiconductor Packaging market has several factors driving the market. The key growth factor is the need to reduce the rising costs involved in designing a compact device with significant power efficiency. In order to design and manufacture such a device, the players in the Global Semiconductor market are focusing more on 3D semiconductor packaging. Further, the key challenge hindering growth is the cyclical nature of the Global Semiconductor market, which is leading to fluctuating demand and revenue for these vendors. Key Topics Covered 1. Executive Summary 2. Introduction 3. Market Coverage 4. Market Landscape 5. Geographical Segmentation 6. Key Leading Countries 7. Vendor Landscape 8. Buying Criteria 9. Market Growth Drivers 10. Drivers and their Impact 11. Market Challenges 12. Impact of Drivers and Challenges 13. Market Trends 14. Key Vendor Analysis Companies Mentioned - Advanced Semiconductor Engineering - Amkor Technology - Powertech Technology - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/rngx9x/global_3d About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Pre-Market Review: Teradyne Inc., Lam Research Corp., Siliconware Precision Industries Co., and Mindspeed Technologies Inc.
PR Newswire - Wed Nov 06, 2:56PM CST
Editor Note: For more information about this release, please scroll to bottom.
Upgrade Alert for Siliconware Precision Industries (SPIL)
Comtex SmarTrend(R) - Fri Nov 01, 7:15AM CDT
Siliconware Precision Industries (NASDAQ:SPIL) was upgraded from Sell to Buy at UBS today. The stock closed yesterday at $5.99 on volume of 452,000 shares, above average daily volume of 346,000. Siliconware Precision Industries (NASDAQ:SPIL) has potential upside of 3.8% based on a current price of $5.99 and analysts' consensus price target of $6.22. Siliconware Precision Industries shares have support at the 50-day moving average (MA) of $5.84 and additional support at the 200-day MA of $5.67.
IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition
M2 - Fri Nov 01, 6:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/zjjjxm/ic_package_pitch) has announced the addition of the "IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition" report to their offering. Integrated circuits (ICs) are placed in a package, which gives the semiconductor die the mechanical and electrical interface to the printed circuit board (PCB). Once packaged, the IC transforms from a 'die' into a 'chip'. This 'IC Package Pitch, Leadframe Plating, And Substrate Markets' report, provides information which will help determine the size of a package, the test socket size, and the footprint of the device on a PCB, as well as provide information on material choices for leadframes, which affects the test companies, printed circuit board manufacturers, and others who delve into the interfaces with the package leadframe. Key Topics Covered 1: Introduction 2: Executive Summary 3: State of the Industry - Economic Overview - Industry Overview 4: Forecasts by IC Package Pitch, by Package Family and by I/O count, 2012 - 2017 Package Type - DIP - SOT - SO - TSOP - FN - CC - QFP - QFN - PGA - BGA - FBGA - WLP 5: IC Package Leadframe and Lead-free Issues - Preplate - Post plate - Lead-free Issues: Tin Whiskers - New Product Introductions -- Lockheed Martin Space Systems Company - Forecasts of the various plating options including Matte Tin, Tin Silver, Tin Copper, Tin Bismuth, Nickel Palladium, and Nickel Palladium Gold 6: IC Package Substrates - Ceramic - Laminate - HDIS - Coreless - Flex Tape - Embedded - Thermal Substrates - Forecasts by Pitch, Units, Area, and Revenue - New Product Introductions -- Fujitsu Components America -- Intel Corporation -- Shinko Electric Industries -- Siliconware Precision Industries Substrates are forecast by material type by package, and standardized for forecasting substrate area. The substrate revenue is also provided. Appendix A: Web Address Guide Appendix B: Glossary of Terms List of Tables and Figures Companies Mentioned - Fujitsu Components America - Intel Corporation - Shinko Electric Industries - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/zj...kage_pitch About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Siliconware Precision Industries Reports a 8.5% Quarter-over-Quarter growth in Revenues Resulting in Earnings per Share of NT$ 0.70 or Earnings per ADS of US$ 0.12 for Third Quarter 2013
PR Newswire - Thu Oct 31, 12:35AM CDT
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the third quarter of 2013 were NT$ 19,092 million, which represented a 8.5% growth in revenues compared to the second quarter of 2013 and a 13.3% growth in revenues compared to the third quarter of 2012. SPIL reported a net income of NT$ 2,184 million for the third quarter of 2013, compared with a net income of NT$ 1,740 million and a net income of NT$ 1,548 million for the second quarter of 2013 and the third quarter of 2012, respectively.
Worldwide Semiconductor Assembly and Test Services Market to 2016
M2 - Fri Oct 25, 8:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/fjtnff/global) has announced the addition of the "Worldwide Semiconductor Assembly and Test Services Market to 2016" report to their offering. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. The key vendors dominating this space include: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. Key questions answered in this report: - What will the market size be in 2016 and what will be the growth rate? - What are key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by key vendors? - What are the strengths and weaknesses of each of these key vendors? Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Introduction 04. Market Research Methodology 05. Scope of the Report 06. Market Landscape 07. Geographical Segmentation 08. Vendor Landscape 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/fjtnff/global
Early Morning Insight: Teradyne Inc., Lam Research Corp., Siliconware Precision Industries Co., and Mindspeed Technologies Inc.
PR Newswire - Tue Oct 15, 7:20AM CDT
Editor Note: For more information about this release, please scroll to bottom.
Today's Technical View: Lam Research Corp., Teradyne Inc., Mindspeed Technologies Inc., and Siliconware Precision Industries Co. Ltd
PR Newswire - Thu Sep 12, 8:38AM CDT
On Wednesday, September 11, 2013, the S&P 500 ended the day at 1,689.13, up 0.31%; the Dow Jones Industrial Average closed at 15,326.60, up 0.89%; while the NASDAQ Composite finished at 3,725.01, down 0.11%. Shares in the semiconductor equipment and materials industry ended on a mixed note, tracking changes in the broader market. The major movers in the sector included Lam Research Corporation (NASDAQ: LRCX), Teradyne Inc. (NYSE: TER), Mindspeed Technologies Inc. (NASDAQ: MSPD), and Siliconware Precision Industries Company (NASDAQ: SPIL). All these companies are tracked by AAAResearchReports.com. Free in-depth technical analysis on LRCX, TER, MSPD, and SPIL are currently available upon signing up at:
SUSS MicroTec honored with SPIL's Outstanding Performance Award
Business Wire - Thu Aug 08, 8:05AM CDT
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the 'Outstanding Performance Award' from SPIL (Siliconware Precision Industries Co., Ltd.) in July 2013.
Global Semiconductor Assembly and Test Services Market 2012-2016: One of the Main Factors Driving the Market Is the Increasing Number of Fabless Companies
M2 - Wed Aug 07, 6:18AM CDT
Research and Markets (http://www.researchandmarkets.com/research/8jd4bt/global) has announced the addition of the "Global Semiconductor Assembly and Test Services Market 2012-2016" report to their offering. The analysts forecast the Global Semiconductor Assembly and Test Services market to grow at a CAGR of 6.5 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing development of new products. The Global Semiconductor Assembly and Test Services market has also been witnessing an increase in the number of collaborations/alliances among providers and manufacturers. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The key vendors dominating this space include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Siliconware Precision Industries Co. Ltd., and STATS ChipPAC Ltd. The other vendors mentioned in this report are Atmel Corp., Broadcom Corp., Cambridge Silicon Radio Ltd., ChipMOS Technologies Ltd., Freescale Semiconductor Inc., JCET-ChangJiang Elec. Tech., J-Devices Corp., Powertech Technology Inc., Qualcomm Inc., and United Test and Assembly Center Ltd. (UTAC). Commenting on the report, an analyst from the team said: One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand. For more information visit http://www.researchandmarkets.com/research/8jd4bt/globa About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Pre-Market Review: Teradyne, Lam Research, Mindspeed Technologies, and Siliconware Precision
PR Newswire - Tue Aug 06, 7:00AM CDT
Editor Note: For more information about this release, please scroll to bottom.
Siliconware Precision Industries Reports a 27.4% Quarter-over-Quarter growth in Revenues Resulting in Earnings per Share of NT$ 0.56 or Earnings per ADS of US$ 0.09 for Second Quarter 2013
PR Newswire - Wed Jul 31, 12:35AM CDT
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the second quarter of 2013 were NT$ 17,602 million, which represented a 27.4% growth in revenues compared to the first quarter of 2013 and a 6.4% growth in revenues compared to the second quarter of 2012. SPIL reported a net income of NT$ 1,740 million for the second quarter of 2013, compared with a net loss of NT$ 292 million and a net income of NT$ 1,564 million for the first quarter of 2013 and the second quarter of 2012, respectively.
Morning Research: Lam Research, Teradyne, ASML Holding, Siliconware Precision, and Mindspeed Technologies
PR Newswire - Tue Jul 02, 11:35AM CDT
Editor Note: For more information about this release, please scroll to bottom.
Siliconware Precision Industries Has Returned 19.4% Since SmarTrend Recommendation (SPIL)
Comtex SmarTrend(R) - Thu Mar 13, 9:42AM CDT
SmarTrend identified an Uptrend for Siliconware Precision Industries (NASDAQ:SPIL) on September 10th, 2013 at $5.85. In approximately 6 months, Siliconware Precision Industries has returned 19.42% as of today's recent price of $6.98.
Siliconware (SPIL) Enters Overbought Territory - Tale of the Tape
Zacks Equity Research - Zacks Investment Research - Thu Mar 13, 8:35AM CDT
Siliconware (SPIL) Enters Overbought Territory
Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016
M2 - Thu Mar 13, 5:05AM CDT
Research and Markets (http://www.researchandmarkets.com/research/sbbp8g/global) has announced the addition of the "Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016" report to their offering. One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. Key Topics Covered: 1. Executive Summary 2. List of Abbreviations 3. Introduction 4. Market Research Methodology 5. Scope of the Report 6. Market Landscape 7. Geographical Segmentation 8. Vendor Landscape 9. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis Companies Mentioned: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. - Atmel Corp. - Broadcom Corp. - Cambridge Silicon Radio Ltd. - ChipMOS Technologies Ltd. - Freescale Semiconductor Inc. - JCET-ChangJiang Elec. Tech. - J-Devices Corp. - Powertech Technology Inc. - Qualcomm Inc. - United Test and Assembly Center Ltd. (UTAC). For more information visit http://www.researchandmarkets.com/research/sbbp8g/global
Leading Canadian Biosolids Solution Provider Coming To North Battleford
GlobeNewswire - Thu Jan 30, 2:42PM CST
The City of North Battleford, Saskatchewan has formally approved plans to bring world-class biosolids solution provider, Lystek International to the community, reducing local landfill pressures and producing a federally registered fertilizer product to benefit agriculture.
Siliconware Precision Industries Reports a 1.3% Quarter-over-Quarter Decline in Revenues Resulting in Earnings per Share of NT$ 0.72 or Earnings per ADS of US$ 0.12 for Fourth Quarter 2013
PR Newswire - Sun Jan 26, 11:35PM CST
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the fourth quarter of 2013 were NT$ 18,844 million, which represented a 1.3% decline in revenues compared to the third quarter of 2013 and a 16.7% growth in revenues compared to the fourth quarter of 2012. SPIL reported a net income of NT$ 2,260 million for the fourth quarter of 2013, compared with a net income of NT$ 2,184 million and a net income of NT$ 1,590 million for the third quarter of 2013 and the fourth quarter of 2012, respectively.
Cost Benefits Drive the Market for Outsourced Semiconductor Assembly and Test (OSAT), According to a New Trend Report Published by Global Industry Analysts, Inc.
PRWeb - Tue Jan 07, 9:51AM CST
Follow us on LinkedIn - Semiconductor assembly involves a process of electrically and mechanically connecting a completely-processed circuit chip/semiconductor device to the package. The Outsourced Semiconductor Assembly and Test (OSAT) market is expected to witness growth driven by the increase in packaging costs and a rapid transformation towards the adoption of outsourcing model. Growing demand for assembly and test equipment and packaging materials from Southeast Asia is also expected to augur well for the global OSAT market. Increasing sophistication and complexity of modern electronics is creating a parallel need for advanced and customized packaging solutions, which in turn requires innovative assembly manufacturing processes. Poised to benefit against this backdrop are OSAT service providers.
Market Research Scanner:Teradyne, Lam Research, and Siliconware Precision Industries
PR Newswire - Fri Dec 27, 7:00AM CST
On Thursday, December 26, 2013, the U.S. equity market edged higher. The S&P 500 ended the day at 1,842.02, up 0.47%; the Dow Jones Industrial Average closed at 16,479.88, up 0.75%; and the NASDAQ Composite Index finished at 4,167.18, up 0.28%. The S&P 500 Information Technology Sector Index edged 0.30% higher to close the session at 583.08; and the S&P 500 Semiconductors & Semiconductor Equipment Industry Index finished at 418.83, up 0.46%. The S&P 500 Semiconductors & Semiconductor Equipment Industry Index has gained 1.63% in the previous three trading sessions and 5.58% in the last one month, outperforming the S&P 500, which has gained 1.30% and 2.19% during the respective periods. The major movers in the information technology sector included Teradyne Inc. (NYSE: TER), Lam Research Corp. (NASDAQ: LRCX) and Siliconware Precision Industries Co. (NASDAQ: SPIL). All these companies are tracked by AAAResearchReports.com. Free technical research on TER, LRCX, and SPIL can be downloaded upon signing up at:
Global 3D Semiconductor Packaging Market 2013 Report
M2 - Wed Nov 20, 3:23AM CST
Research and Markets (http://www.researchandmarkets.com/research/rngx9x/global_3d) has announced the addition of the Global 3D Semiconductor Packaging Market 2013 Report to their offering. Global 3D Semiconductor Packaging Market Expected To Grow At A CAGR Of 58.1 Percent Over The Period 2012-2016 The report provides an in-depth market analysis with inputs from industry experts. Commenting on the report, an analyst from the researchers' Hardware team said: ''The semiconductor packaging companies are expected to have large packaging capacities as a primary criterion to receive orders from the semiconductor chip manufacturers. The semiconductor chip manufacturers tend to prefer to outsource their packaging to one capable and reliable vendor rather than to a number of vendors. As a result, the players in this market are increasing their capacity in terms of machinery as well as staffing levels to cope with the demand from their customers'' According to the report, the Global 3D Semiconductor Packaging market has several factors driving the market. The key growth factor is the need to reduce the rising costs involved in designing a compact device with significant power efficiency. In order to design and manufacture such a device, the players in the Global Semiconductor market are focusing more on 3D semiconductor packaging. Further, the key challenge hindering growth is the cyclical nature of the Global Semiconductor market, which is leading to fluctuating demand and revenue for these vendors. Key Topics Covered 1. Executive Summary 2. Introduction 3. Market Coverage 4. Market Landscape 5. Geographical Segmentation 6. Key Leading Countries 7. Vendor Landscape 8. Buying Criteria 9. Market Growth Drivers 10. Drivers and their Impact 11. Market Challenges 12. Impact of Drivers and Challenges 13. Market Trends 14. Key Vendor Analysis Companies Mentioned - Advanced Semiconductor Engineering - Amkor Technology - Powertech Technology - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/rngx9x/global_3d About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Pre-Market Review: Teradyne Inc., Lam Research Corp., Siliconware Precision Industries Co., and Mindspeed Technologies Inc.
PR Newswire - Wed Nov 06, 2:56PM CST
Editor Note: For more information about this release, please scroll to bottom.
Upgrade Alert for Siliconware Precision Industries (SPIL)
Comtex SmarTrend(R) - Fri Nov 01, 7:15AM CDT
Siliconware Precision Industries (NASDAQ:SPIL) was upgraded from Sell to Buy at UBS today. The stock closed yesterday at $5.99 on volume of 452,000 shares, above average daily volume of 346,000. Siliconware Precision Industries (NASDAQ:SPIL) has potential upside of 3.8% based on a current price of $5.99 and analysts' consensus price target of $6.22. Siliconware Precision Industries shares have support at the 50-day moving average (MA) of $5.84 and additional support at the 200-day MA of $5.67.
IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition
M2 - Fri Nov 01, 6:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/zjjjxm/ic_package_pitch) has announced the addition of the "IC Package Pitch, Leadframe Plating, And Substrate Markets - 2013 Edition" report to their offering. Integrated circuits (ICs) are placed in a package, which gives the semiconductor die the mechanical and electrical interface to the printed circuit board (PCB). Once packaged, the IC transforms from a 'die' into a 'chip'. This 'IC Package Pitch, Leadframe Plating, And Substrate Markets' report, provides information which will help determine the size of a package, the test socket size, and the footprint of the device on a PCB, as well as provide information on material choices for leadframes, which affects the test companies, printed circuit board manufacturers, and others who delve into the interfaces with the package leadframe. Key Topics Covered 1: Introduction 2: Executive Summary 3: State of the Industry - Economic Overview - Industry Overview 4: Forecasts by IC Package Pitch, by Package Family and by I/O count, 2012 - 2017 Package Type - DIP - SOT - SO - TSOP - FN - CC - QFP - QFN - PGA - BGA - FBGA - WLP 5: IC Package Leadframe and Lead-free Issues - Preplate - Post plate - Lead-free Issues: Tin Whiskers - New Product Introductions -- Lockheed Martin Space Systems Company - Forecasts of the various plating options including Matte Tin, Tin Silver, Tin Copper, Tin Bismuth, Nickel Palladium, and Nickel Palladium Gold 6: IC Package Substrates - Ceramic - Laminate - HDIS - Coreless - Flex Tape - Embedded - Thermal Substrates - Forecasts by Pitch, Units, Area, and Revenue - New Product Introductions -- Fujitsu Components America -- Intel Corporation -- Shinko Electric Industries -- Siliconware Precision Industries Substrates are forecast by material type by package, and standardized for forecasting substrate area. The substrate revenue is also provided. Appendix A: Web Address Guide Appendix B: Glossary of Terms List of Tables and Figures Companies Mentioned - Fujitsu Components America - Intel Corporation - Shinko Electric Industries - Siliconware Precision Industries For more information visit http://www.researchandmarkets.com/research/zj...kage_pitch About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Siliconware Precision Industries Reports a 8.5% Quarter-over-Quarter growth in Revenues Resulting in Earnings per Share of NT$ 0.70 or Earnings per ADS of US$ 0.12 for Third Quarter 2013
PR Newswire - Thu Oct 31, 12:35AM CDT
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the third quarter of 2013 were NT$ 19,092 million, which represented a 8.5% growth in revenues compared to the second quarter of 2013 and a 13.3% growth in revenues compared to the third quarter of 2012. SPIL reported a net income of NT$ 2,184 million for the third quarter of 2013, compared with a net income of NT$ 1,740 million and a net income of NT$ 1,548 million for the second quarter of 2013 and the third quarter of 2012, respectively.
Worldwide Semiconductor Assembly and Test Services Market to 2016
M2 - Fri Oct 25, 8:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/fjtnff/global) has announced the addition of the "Worldwide Semiconductor Assembly and Test Services Market to 2016" report to their offering. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. The key vendors dominating this space include: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. Key questions answered in this report: - What will the market size be in 2016 and what will be the growth rate? - What are key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by key vendors? - What are the strengths and weaknesses of each of these key vendors? Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Introduction 04. Market Research Methodology 05. Scope of the Report 06. Market Landscape 07. Geographical Segmentation 08. Vendor Landscape 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/fjtnff/global
Early Morning Insight: Teradyne Inc., Lam Research Corp., Siliconware Precision Industries Co., and Mindspeed Technologies Inc.
PR Newswire - Tue Oct 15, 7:20AM CDT
Editor Note: For more information about this release, please scroll to bottom.
Today's Technical View: Lam Research Corp., Teradyne Inc., Mindspeed Technologies Inc., and Siliconware Precision Industries Co. Ltd
PR Newswire - Thu Sep 12, 8:38AM CDT
On Wednesday, September 11, 2013, the S&P 500 ended the day at 1,689.13, up 0.31%; the Dow Jones Industrial Average closed at 15,326.60, up 0.89%; while the NASDAQ Composite finished at 3,725.01, down 0.11%. Shares in the semiconductor equipment and materials industry ended on a mixed note, tracking changes in the broader market. The major movers in the sector included Lam Research Corporation (NASDAQ: LRCX), Teradyne Inc. (NYSE: TER), Mindspeed Technologies Inc. (NASDAQ: MSPD), and Siliconware Precision Industries Company (NASDAQ: SPIL). All these companies are tracked by AAAResearchReports.com. Free in-depth technical analysis on LRCX, TER, MSPD, and SPIL are currently available upon signing up at:
SUSS MicroTec honored with SPIL's Outstanding Performance Award
Business Wire - Thu Aug 08, 8:05AM CDT
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the 'Outstanding Performance Award' from SPIL (Siliconware Precision Industries Co., Ltd.) in July 2013.
Global Semiconductor Assembly and Test Services Market 2012-2016: One of the Main Factors Driving the Market Is the Increasing Number of Fabless Companies
M2 - Wed Aug 07, 6:18AM CDT
Research and Markets (http://www.researchandmarkets.com/research/8jd4bt/global) has announced the addition of the "Global Semiconductor Assembly and Test Services Market 2012-2016" report to their offering. The analysts forecast the Global Semiconductor Assembly and Test Services market to grow at a CAGR of 6.5 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing development of new products. The Global Semiconductor Assembly and Test Services market has also been witnessing an increase in the number of collaborations/alliances among providers and manufacturers. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The key vendors dominating this space include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Siliconware Precision Industries Co. Ltd., and STATS ChipPAC Ltd. The other vendors mentioned in this report are Atmel Corp., Broadcom Corp., Cambridge Silicon Radio Ltd., ChipMOS Technologies Ltd., Freescale Semiconductor Inc., JCET-ChangJiang Elec. Tech., J-Devices Corp., Powertech Technology Inc., Qualcomm Inc., and United Test and Assembly Center Ltd. (UTAC). Commenting on the report, an analyst from the team said: One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand. For more information visit http://www.researchandmarkets.com/research/8jd4bt/globa About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Pre-Market Review: Teradyne, Lam Research, Mindspeed Technologies, and Siliconware Precision
PR Newswire - Tue Aug 06, 7:00AM CDT
Editor Note: For more information about this release, please scroll to bottom.
Siliconware Precision Industries Reports a 27.4% Quarter-over-Quarter growth in Revenues Resulting in Earnings per Share of NT$ 0.56 or Earnings per ADS of US$ 0.09 for Second Quarter 2013
PR Newswire - Wed Jul 31, 12:35AM CDT
Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325, NASDAQ: SPIL) today announced that its consolidated sales revenues for the second quarter of 2013 were NT$ 17,602 million, which represented a 27.4% growth in revenues compared to the first quarter of 2013 and a 6.4% growth in revenues compared to the second quarter of 2012. SPIL reported a net income of NT$ 1,740 million for the second quarter of 2013, compared with a net loss of NT$ 292 million and a net income of NT$ 1,564 million for the first quarter of 2013 and the second quarter of 2012, respectively.
Morning Research: Lam Research, Teradyne, ASML Holding, Siliconware Precision, and Mindspeed Technologies
PR Newswire - Tue Jul 02, 11:35AM CDT
Editor Note: For more information about this release, please scroll to bottom.
