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Global Semiconductor Metal Etching Equipment Market 2014-2018 Research Report
M2 - Fri Feb 28, 4:16AM CST
Research and Markets (http://www.researchandmarkets.com/research/5qgz3t/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Semiconductor Metal Etching Equipment market to grow at a CAGR of 0.37 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Metal Etching Equipment market has also been witnessing the emergence of product miniaturization. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Semiconductor Metal Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Semiconductor Metal Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Applied Materials Inc., Hitachi High-Technologies Corp., and Lam Research Corp. Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., Semes Co. Ltd., Tokyo Electron Ltd., and ULVAC Technologies Inc. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5qgz3t/global About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018
M2 - Thu Feb 27, 4:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/kcwblg/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018" report to their offering. The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. The key vendors dominating this market space are: - ASML Holding N.V - Tokyo Electron Ltd. - Applied Materials Inc. (AMAT) - Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report: - Ebara Corp. - Canon Inc. - Lam Research Corp. - Nikon Corp. - Hitachi High-Technologies. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Market Segmentation by Type 08. Geographical Segmentation 09. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/kc..._front_end
Global and Chinese Semiconductor Equipment Industry Report, 2013-2014
M2 - Fri Feb 14, 2:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/h4sxrs/global_and) has announced the addition of the "Global and Chinese Semiconductor Equipment Industry Report, 2013-2014" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments. EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use. Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing. Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered 1 Global Semiconductor Industry 1.1Overview 1.2 DRAM Memory Industry 1.3 NAND Flash Memory 1.4 IC Fabrication and Wafer Foundry 1.5 Overview of IC Packaging and Testing Industry 1.6 Chinese IC Market 1.7 Semiconductor Industry in Mainland China 2 Semiconductor Equipment Industry 2.1 Semiconductor Equipment Market 2.2 Etching Equipment Industry 2.3 Thin Film Deposition Equipment Industry 2.4 Lithography Equipment Industry 2.5 EUV or Multiple Patterning for the Next Generation 2.6 Semiconductor Process Control Equipment 2.7 Compound Semiconductor Equipment Market 2.8 Ranking of Semiconductor Equipment Vendors 3 Major Semiconductor Equipment Vendors 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned - ASM International - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/h4sxrs/global_and About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Piston Partners With Tokyo Electron Device to Accelerate OpenStack Private Cloud Adoption in Japan
Marketwire - Wed Feb 12, 8:00AM CST
Piston Cloud Computing, Inc., the enterprise OpenStack(TM) company, today announced that it has entered into a partnership with Tokyo Electron Device to distribute Piston OpenStack(TM) in Japan. Tokyo Electron Device (TED), a technical trading firm that provides semiconductor products and business solutions, also commissions the design and development of its own brand products. The partnership combines the power of Piston OpenStack(TM), the company's global-scale private cloud software, with TED's superior technical support and unmatched quality assurance to help customers meet their critical business objectives.
Lehman Brothers Settlement and Cannabis Hype Fuel Active Penny Stocks: Fannie Mae (OTC Bulletin Board: FNMA), Plandai Biotechnology (OTCQB: PLPL), AIA Group, Ltd. (OTCPINK: AAGIY), Tokyo Electron Ltd. (OTCPINK: TOELY)
ACCESSWIRE - Mon Feb 03, 7:02AM CST
A long, dragged-out, Lehman Brothers settlement with Fannie Mae coming to fruition, hype on the legal-marijuana industry and general speculation about an economic recovery is fueling stock volume on the most active penny stocks. Lehman Brothers Settles With Fannie Mae In the mortgage sector, Fannie Mae (OTC Bulletin Board: FNMA) shares continue to be a very active stock. The government-sponsored enterprise, charged with stabilizing the secondary mortgage market, traded 7,628,050 shares Jan. 31. In part, this could be due to Judge James Peck approval on Jan. 29 of Lehman Brothers Holdings Inc.'s settlement with Fannie Mae over $18.9 billion in mortgage claims. Fannie Mae will receive a general unsecured claim of $2.15 billion against Lehman. Under Lehman's Chapter 11 payment plan, this amounts to a recovery of about 25 cents on the dollar, or about $537.5 million. In addition, Fannie Mae and others' optimistic outlook for the 2014 housing market is fueling its spike in volume. In a Jan. 13 statement, Fannie Mae's Chief Economist Doug Duncan said that despite the rise in mortgage rates since the spring, many housing indicators posted strong gains at the end of 2013 and consumer housing attitudes are strengthening, "all of which bodes well for continued but measured housing recovery in 2014." In addition, Fannie Mae's sister company Freddie Mac (FMCC), is planning to sell $1 billion of securities tied to the risk of homeowner defaults, almost matching the amount issued since the deals began last year. This is according to a person with knowledge of the transaction. FNMA shares closed at $3.11 up 2 cents from its closing price of $3.11 the previous day.
Global Atomic Layer Deposition Market 2014-2018: Growing Demand for Miniaturized Components Is One of the Major Drivers of the Global ALD Market
M2 - Fri Jan 24, 3:50AM CST
Research and Markets (http://www.researchandmarkets.com/research/dqkptl/global_atomic) has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. The analysts forecast the Global Atomic Layer Deposition market to grow at a CAGR of 36.10 percent over the period 2013-2018. One of the key factors contributing to this market growth is the growing demand for miniaturized components. The Global Atomic Layer Deposition market has also been witnessing the development of new atomic layer deposition materials. However, the slow deposition rate of atomic layer deposition could pose a challenge to the growth of this market. Key vendors dominating this space include Adeka Corp., Applied Materials Inc., and ASM International N.V. Other vendors mentioned in the report are Air Liquide S.A., Air Products and Chemicals Inc., AIXTRON SE, Arradiance Inc., ATMI Inc., Beneq Oy, Centrotherm Photovoltaics AG, Encapsulix SAS, Hitachi Kokusai Electric Inc., Kurt J. Lesker Co., Levitech BV, NCD Co. Ltd., Nova-Kem LLC., Oxford Instruments plc, Picosun Oy, Praxair Technology Inc., SENTECH Instruments GmbH, SoLayTec, Strem Chemicals Inc., SVT Associates Inc., Tokyo Electron Ltd., Tosoh Corp., Ultratech Inc., and Veeco Instruments Inc. Commenting on the report, an analyst from the team said: Development of new ALD materials is one of the major trends in the Global ALD market. The development of new ALD materials is expected to occur in the near future as several ALD material manufacturers are investing a huge amount to develop new ALD materials across the globe. In the last few years, the market has witnessed the introduction of some new materials such as Porous SiOC, AlO, Hf(Si)O, ZrO, LaO, and SiC by the vendors. The development of several new ALD materials is required for the in-depth understanding of growth of thin deposition layers and nanostructures to both inorganic and organic surfaces. For more information visit http://www.researchandmarkets.com/research/dq...bal_atomic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Semiconductor Industry Enters 2014 Saddled with Structural Challenges, with Over Half of Public Companies Facing Possible Financial Distress, According to AlixPartners Study
GlobeNewswire - Thu Jan 23, 12:04AM CST
Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the industry could see more consolidation, including via M &A, this year, coming on the heels of recently-announced deals such as those involving Avago Technologies and LSI, Micron and Elpida Memory, and Applied Materials and Tokyo Electron. That's according to a new study from AlixPartners, the global business advisory firm.
Tokyo Electron Presents Results of Kextil Pilot at Technology Services World
PR Newswire - Mon Jan 13, 7:30AM CST
Global field service organizations have been demanding a solution that can provide a detailed understanding of the work performed by the field. To date this has been impossible, as the time required to capture detailed documentation prevents the field from meeting ever tightening response times. Now, Kextil (http://www.kextil.com/) eliminates this trade off.
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018
M2 - Wed Jan 08, 10:03AM CST
Research and Markets (http://www.researchandmarkets.com/research/2ht7ts/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Front End of the Line (FEOL) Semiconductor Separation Equipment market to grow at a CAGR of 4.13 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing adoption of mobile devices. The Global Front End of the Line (FEOL) Semiconductor Separation Equipment market has also been witnessing rapid technological advancement. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market. The key vendors dominating this market space are ASML Holding N.V., Tokyo Electron Ltd., Applied Materials Inc. (AMAT), and Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report are Ebara Corp., Canon Inc., Lam Research Corp., Nikon Corp., and Hitachi High-Technologies. Commenting on the report, an analyst from the team said: The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. For more information visit http://www.researchandmarkets.com/research/2h..._front_end About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II
M2 - Tue Jan 07, 6:47AM CST
Research and Markets (http://www.researchandmarkets.com/research/kff87c/revenue) has announced the addition of the "Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip" report to their offering. The traditional architectural and material assumptions with regard to how integrated circuits are fabricated have been challenged in recent years and the semiconductor industry is looking for new solutions. Power and thermal issues add to this apparent crisis in the semiconductor industry. The obvious solution is to deploy fiber optics; which is usually the way to go whenever and wherever there is a bandwidth problem. But fiber optic solutions to on-chip and chip-to-chip interconnection is something that will be hard to develop for commercial chip products. Producing photonic devices that are small enough and inexpensive enough to be used at the chip level is an immensely difficult requirement. In this report, the author analyzes the latest developments in optical interconnection at the chip level and the progress in this area that is being made by important research teams throughout the world. Both R&D and commercial development are discussed. The report looks at this issue from the perspective of classic CPU chips as well as the latest architectures, and the opportunities for optical interconnection are compared to a possible future for metal interconnects and interconnect alternatives that are even more exotic than photonics; carbon nanotubes, especially. The report also contains a 10-year roadmap that explains where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection. Companies Mentioned: - Avago - Cisco - Corning - Dow Chemical - Dow-Corning - DuPont - Finisar - Fujitsu - Furukawa - IBM - Intel - Juniper - Kotura - Micron - Novellus - Optical Interlinks - QD Laser - Reflex Photonics - Samtec - Sumitomo - TeraXion - Tokyo Electron - ULM Photonics - VI Systems For more information visit http://www.researchandmarkets.com/research/kff87c/revenue About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Semiconductor Capital Equipment Market to 2016: Lam Research, Tokyo Electron, ASML & Applied Materials Dominate
PR Newswire Europe - Tue Dec 03, 12:00PM CST
DUBLIN, Ireland, December 3, 2013 /PRNewswire/ --
Tokyo Electron Device Announces Release of TB-7VX-690T/-980T/-1140T-PCIEXP Development Test Platforms with Virtex-7 FPGA, Supporting Large-Scale PCI Express Gen3
Business Wire - Tue Nov 19, 7:00AM CST
Tokyo Electron Device Limited (TED) has announced the launch of the new Virtex-7 FPGA evaluation platform; TB-7VX-690T/-980T/-1140T-PCIEXP (TB-7VX-xxxT-PCIEXP, hereinafter) which supports large-scale PCI Express Gen3.
Research and Markets: Global Semiconductor Capital Equipment Market to 2016: Lam Research, Tokyo Electron, ASML & Applied Materials Dominate
Business Wire - Thu Nov 07, 10:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/k7ph66/global) has announced the addition of the "Global Semiconductor Capital Equipment Market 2012-2016" report to their offering.
Global BEOL Wiring Development Equipment Market 2012-2016
M2 - Mon Oct 28, 7:08AM CDT
Research and Markets (http://www.researchandmarkets.com/research/tx8xb6/global_beol) has announced the addition of the "Global BEOL Wiring Development Equipment Market 2012-2016" report to their offering. Global BEOL Wiring Development Equipment Market To Grow At A CAGR Of 1.56 Percent Over The Period 2012-2016 The report provides an in-depth analysis of the global BEOL wiring development equipment market. Commenting on the report, an analyst from researchers' the team said: The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel BEOL wiring development equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the adoption of mobile devices. Many consumers in the market have been increasingly adopting mobile devices such as cell phones, smartphones, notebook PCs, tablets, Ultrabooks, and PDAs. This increased demand for mobile devices is leading to the increasing demand for BEOL wiring development equipment as it is vital for the functioning of mobile devices. One of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for BEOL wiring development equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. Key Topics Covered 1. Executive Summary 2. Scope of the Report 3. Market Research Methodology 4. List of Abbreviations 5. Introduction 6. Market Landscape 7. Market Segmentation by Type 8. Geographical Segmentation 9. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis 19. Key Takeaways Companies Mentioned - ASML - Applied Materials - Canon - Dainippon Screen Manufacturing - Ebara - Hitachi High-Technologies - Lam Research - Nikon - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/tx...lobal_beol
New Report Predicts That Chip-Level Optical Interconnect Market Will Generate $520 million in Revenues by 2019
M2 - Mon Oct 21, 6:52AM CDT
Research and Markets (http://www.researchandmarkets.com/research/ghtv86/revenue) has announced the addition of the "Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip" report to their offering. According to this newly released report, the addressable market for chip-level optical interconnects could eventually run into billions of units and revenues in this market will total almost $520 million by 2019 going on to reach $1.02 billion by 2021. The new report is titled Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Volume II: On-Chip and Chip-to-Chip and continues the firm's coverage of this market dating back to 2009. The report covers four kinds of chip-level interconnect: optical engines, photonic integrated circuit (PIC)-based interconnects, silicon photonics and free-space optics. It includes nine-year (volume and value) forecasts with breakouts by active components along with fiber and waveguide transmission media. Compound semiconductor, silicon and polymer waveguides are covered, as are VCSELs, silicon lasers and quantum dot lasers. In addition, the report contains assessments of the latest business and technology strategies in the chip-level optical interconnect space. The growing popularity of parallel computing, and the arrival of multicore processors and 3D chips are leading to data traffic jams both on-chip and chip-to-chip. However, the report believes that these trends are also creating opportunities for chip-level optical interconnects. Avago, Finisar, IBM and Samtec have all proposed optical engines for chip-level interconnect. These miniaturized optical assemblies are currently the most mature technology available for this application and will generate revenues of $235 million in 2019. However, with their attached connectors and heat sinks, optical engines may prove too large for complex optical interconnection environments, such as in the coming generation of Exascale supercomputers. Because of the limitations of optical engines, there are emerging opportunities for compact PIC- based interconnect devices based on indium phosphide and gallium arsenide. The author says these opportunities will generate $120 million in 2019 increasing to $275 million by 2021. However, bonding PIC interconnects onto a silicon processor or memory chip is both technically challenging and expensive. So far, only a few PIC and VCSEL technology companies have pursued the interconnect opportunity. Companies Mentioned: - Avago - Cisco - Corning - Dow Chemical - Dow-Corning - DuPont - Finisar - Fujitsu - Furukawa - IBM - Intel - Juniper - Kotura - Micron - Novellus - Optical Interlinks - QD Laser - Reflex Photonics - Samtec - Sumitomo - TeraXion - Tokyo Electron - ULM Photonics - VI Systems For more information visit http://www.researchandmarkets.com/research/ghtv86/revenue About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Research and Markets: Global Semiconductor Wafer Cleaning Systems Market 2012-2016 with Lam research, Tokyo Electron & Dainippon Screen Manufacturing Dominating
Business Wire - Tue Oct 15, 4:56AM CDT
Research and Markets (http://www.researchandmarkets.com/research/66lpb7/global) has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2012-2016" report to their offering.
Global Semiconductor Wafer Cleaning Systems Market 2012-2016 with Lam research, Tokyo Electron & Dainippon Screen Manufacturing Dominating
M2 - Tue Oct 15, 3:59AM CDT
Research and Markets (http://www.researchandmarkets.com/research/t249cl/global) has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2012-2016" report to their offering. Global Semiconductor Wafer Cleaning Systems market to grow at a CAGR of 15.92 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing demand for smartphones and tablets. The Global Semiconductor Wafer Cleaning Systems market has also been witnessing an increase in collaborations. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market. According to the report, the biggest factor contributing to the growth of the market is the rising demand for smartphones and tablets. The growing demand for these devices is primarily due to the increasing adoption of these devices in emerging markets. Therefore, this rising demand has subsequently created more demand for semiconductor wafers, thus driving the growth of the Global Semiconductor Wafer Cleaning Systems market. Further, the report states that the most bothering issue for the market is the cyclical nature of the Semiconductor industry. The wafer cleaning equipment manufacturers often experience fluctuating revenues as a result of the unstable market condition, which in turn adversely affects profitability. The key vendors dominating this space include: - Dainippon Screen Manufacturing Co. Ltd. - Lam Research Corp. - Tokyo Electron Ltd. The other vendors mentioned in this report are: - Akrion Systems LLC - Axcelis Technologies Inc. - FSI International Inc. - GlobalFoundries Inc. - SEMES Co. Ltd. - Samsung Electronics Co. Ltd. - Semiconductor Manufacturing International Corp. - Taiwan Semiconductor Manufacturing Co. Ltd. - United Microelectronics Corp. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Introduction 04. Market Research Methodology 05. Scope of the Report 06. Market Landscape 07. Geographical Segmentation 08. Key Leading Countries 09. Vendor Landscape 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/t249cl/global
Global Semiconductor Metal Etching Equipment Market 2014-2018 Research Report
M2 - Fri Feb 28, 4:16AM CST
Research and Markets (http://www.researchandmarkets.com/research/5qgz3t/global) has announced the addition of the "Global Semiconductor Metal Etching Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Semiconductor Metal Etching Equipment market to grow at a CAGR of 0.37 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Metal Etching Equipment market has also been witnessing the emergence of product miniaturization. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market. The report, the Global Semiconductor Metal Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Semiconductor Metal Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors dominating this space are Applied Materials Inc., Hitachi High-Technologies Corp., and Lam Research Corp. Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., Semes Co. Ltd., Tokyo Electron Ltd., and ULVAC Technologies Inc. Key questions answered in this report: - What will the market size be in 2018 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Key Topics Covered: Executive Summary List of Abbreviations Scope of the Report Market Research Methodology Introduction Market Landscape Geographical Segmentation Key Leading Countries Buying Criteria Market Growth Drivers Drivers and their Impact Market Challenges Impact of Drivers and Challenges Market Trends Trends and their Impact Vendor Landscape Key Vendor Analysis Other Reports in this Series List of Exhibits For more information visit http://www.researchandmarkets.com/research/5qgz3t/global About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Wafer-level Packaging Equipment Market 2014-2018
M2 - Thu Feb 27, 5:32AM CST
Research and Markets (http://www.researchandmarkets.com/research/35r9bx/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering. To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap. Key vendors dominating this space are: - Applied Materials Inc - Disco Corp. - EV Group - Tokyo Electron Ltd. - Tokyo Seimitsu Co. Ltd. Other vendors mentioned in the report are: - Rudolph Technologies Inc. - SEMES Co. Ltd. - Suss Microtec AG - Ultratech Inc - ULVAC. For more information visit http://www.researchandmarkets.com/research/35r9bx/global
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018
M2 - Thu Feb 27, 4:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/kcwblg/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market Forecasts & Opportunities, 2018" report to their offering. The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. The key vendors dominating this market space are: - ASML Holding N.V - Tokyo Electron Ltd. - Applied Materials Inc. (AMAT) - Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report: - Ebara Corp. - Canon Inc. - Lam Research Corp. - Nikon Corp. - Hitachi High-Technologies. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 04. Market Research Methodology 05. Introduction 06. Market Landscape 07. Market Segmentation by Type 08. Geographical Segmentation 09. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/kc..._front_end
Global and Chinese Semiconductor Equipment Industry Report, 2013-2014
M2 - Fri Feb 14, 2:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/h4sxrs/global_and) has announced the addition of the "Global and Chinese Semiconductor Equipment Industry Report, 2013-2014" report to their offering. After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel's reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM. In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments. EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use. Equipment vendors have failed to catch up with the development of foundry, especially the ASML which almost monopolize the global lithography market, so foundry will have to slow down their pace towards advanced node. The cost of multiple patterning may be OK for customers, but it is not the case when it comes to the cost of triple patterning. Nevertheless, this cannot prevent industrial players from making continued research, so the procurement of equipments still keeps growing. Taiwan became the largest semiconductor equipment market. Taiwan-based industrial players such as TSMC and UMC make bulk buying of advanced equipments. The estimate shows that Taiwan semiconductor equipment market size will bag USD10.99 billion by 2014 and that the figure by 2015 will slightly decline to USD10.88 billion. Key Topics Covered 1 Global Semiconductor Industry 1.1Overview 1.2 DRAM Memory Industry 1.3 NAND Flash Memory 1.4 IC Fabrication and Wafer Foundry 1.5 Overview of IC Packaging and Testing Industry 1.6 Chinese IC Market 1.7 Semiconductor Industry in Mainland China 2 Semiconductor Equipment Industry 2.1 Semiconductor Equipment Market 2.2 Etching Equipment Industry 2.3 Thin Film Deposition Equipment Industry 2.4 Lithography Equipment Industry 2.5 EUV or Multiple Patterning for the Next Generation 2.6 Semiconductor Process Control Equipment 2.7 Compound Semiconductor Equipment Market 2.8 Ranking of Semiconductor Equipment Vendors 3 Major Semiconductor Equipment Vendors 4 Semiconductor Downstream Market 4.1 Mobile Phone Market 4.2 PC Market Companies Mentioned - ASM International - ASM Pacific - ASML - Advantest - Applied Materials - DAINIPPON SCREEN - Hitachi High-Technologies - KLA-Tencor - Kulicke & Soffa - Lam Research - Nikon Precision - Teradyne - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/h4sxrs/global_and About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.
Piston Partners With Tokyo Electron Device to Accelerate OpenStack Private Cloud Adoption in Japan
Marketwire - Wed Feb 12, 8:00AM CST
Piston Cloud Computing, Inc., the enterprise OpenStack(TM) company, today announced that it has entered into a partnership with Tokyo Electron Device to distribute Piston OpenStack(TM) in Japan. Tokyo Electron Device (TED), a technical trading firm that provides semiconductor products and business solutions, also commissions the design and development of its own brand products. The partnership combines the power of Piston OpenStack(TM), the company's global-scale private cloud software, with TED's superior technical support and unmatched quality assurance to help customers meet their critical business objectives.
Lehman Brothers Settlement and Cannabis Hype Fuel Active Penny Stocks: Fannie Mae (OTC Bulletin Board: FNMA), Plandai Biotechnology (OTCQB: PLPL), AIA Group, Ltd. (OTCPINK: AAGIY), Tokyo Electron Ltd. (OTCPINK: TOELY)
ACCESSWIRE - Mon Feb 03, 7:02AM CST
A long, dragged-out, Lehman Brothers settlement with Fannie Mae coming to fruition, hype on the legal-marijuana industry and general speculation about an economic recovery is fueling stock volume on the most active penny stocks. Lehman Brothers Settles With Fannie Mae In the mortgage sector, Fannie Mae (OTC Bulletin Board: FNMA) shares continue to be a very active stock. The government-sponsored enterprise, charged with stabilizing the secondary mortgage market, traded 7,628,050 shares Jan. 31. In part, this could be due to Judge James Peck approval on Jan. 29 of Lehman Brothers Holdings Inc.'s settlement with Fannie Mae over $18.9 billion in mortgage claims. Fannie Mae will receive a general unsecured claim of $2.15 billion against Lehman. Under Lehman's Chapter 11 payment plan, this amounts to a recovery of about 25 cents on the dollar, or about $537.5 million. In addition, Fannie Mae and others' optimistic outlook for the 2014 housing market is fueling its spike in volume. In a Jan. 13 statement, Fannie Mae's Chief Economist Doug Duncan said that despite the rise in mortgage rates since the spring, many housing indicators posted strong gains at the end of 2013 and consumer housing attitudes are strengthening, "all of which bodes well for continued but measured housing recovery in 2014." In addition, Fannie Mae's sister company Freddie Mac (FMCC), is planning to sell $1 billion of securities tied to the risk of homeowner defaults, almost matching the amount issued since the deals began last year. This is according to a person with knowledge of the transaction. FNMA shares closed at $3.11 up 2 cents from its closing price of $3.11 the previous day.
Global Atomic Layer Deposition Market 2014-2018: Growing Demand for Miniaturized Components Is One of the Major Drivers of the Global ALD Market
M2 - Fri Jan 24, 3:50AM CST
Research and Markets (http://www.researchandmarkets.com/research/dqkptl/global_atomic) has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. The analysts forecast the Global Atomic Layer Deposition market to grow at a CAGR of 36.10 percent over the period 2013-2018. One of the key factors contributing to this market growth is the growing demand for miniaturized components. The Global Atomic Layer Deposition market has also been witnessing the development of new atomic layer deposition materials. However, the slow deposition rate of atomic layer deposition could pose a challenge to the growth of this market. Key vendors dominating this space include Adeka Corp., Applied Materials Inc., and ASM International N.V. Other vendors mentioned in the report are Air Liquide S.A., Air Products and Chemicals Inc., AIXTRON SE, Arradiance Inc., ATMI Inc., Beneq Oy, Centrotherm Photovoltaics AG, Encapsulix SAS, Hitachi Kokusai Electric Inc., Kurt J. Lesker Co., Levitech BV, NCD Co. Ltd., Nova-Kem LLC., Oxford Instruments plc, Picosun Oy, Praxair Technology Inc., SENTECH Instruments GmbH, SoLayTec, Strem Chemicals Inc., SVT Associates Inc., Tokyo Electron Ltd., Tosoh Corp., Ultratech Inc., and Veeco Instruments Inc. Commenting on the report, an analyst from the team said: Development of new ALD materials is one of the major trends in the Global ALD market. The development of new ALD materials is expected to occur in the near future as several ALD material manufacturers are investing a huge amount to develop new ALD materials across the globe. In the last few years, the market has witnessed the introduction of some new materials such as Porous SiOC, AlO, Hf(Si)O, ZrO, LaO, and SiC by the vendors. The development of several new ALD materials is required for the in-depth understanding of growth of thin deposition layers and nanostructures to both inorganic and organic surfaces. For more information visit http://www.researchandmarkets.com/research/dq...bal_atomic About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Semiconductor Industry Enters 2014 Saddled with Structural Challenges, with Over Half of Public Companies Facing Possible Financial Distress, According to AlixPartners Study
GlobeNewswire - Thu Jan 23, 12:04AM CST
Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the industry could see more consolidation, including via M &A, this year, coming on the heels of recently-announced deals such as those involving Avago Technologies and LSI, Micron and Elpida Memory, and Applied Materials and Tokyo Electron. That's according to a new study from AlixPartners, the global business advisory firm.
Tokyo Electron Presents Results of Kextil Pilot at Technology Services World
PR Newswire - Mon Jan 13, 7:30AM CST
Global field service organizations have been demanding a solution that can provide a detailed understanding of the work performed by the field. To date this has been impossible, as the time required to capture detailed documentation prevents the field from meeting ever tightening response times. Now, Kextil (http://www.kextil.com/) eliminates this trade off.
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018
M2 - Wed Jan 08, 10:03AM CST
Research and Markets (http://www.researchandmarkets.com/research/2ht7ts/global_front_end) has announced the addition of the "Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018" report to their offering. The analysts forecast the Global Front End of the Line (FEOL) Semiconductor Separation Equipment market to grow at a CAGR of 4.13 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing adoption of mobile devices. The Global Front End of the Line (FEOL) Semiconductor Separation Equipment market has also been witnessing rapid technological advancement. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market. The key vendors dominating this market space are ASML Holding N.V., Tokyo Electron Ltd., Applied Materials Inc. (AMAT), and Dainippon Screen Manufacturing Co. Ltd. Other vendors mentioned in the report are Ebara Corp., Canon Inc., Lam Research Corp., Nikon Corp., and Hitachi High-Technologies. Commenting on the report, an analyst from the team said: The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices. For more information visit http://www.researchandmarkets.com/research/2h..._front_end About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II
M2 - Tue Jan 07, 6:47AM CST
Research and Markets (http://www.researchandmarkets.com/research/kff87c/revenue) has announced the addition of the "Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip" report to their offering. The traditional architectural and material assumptions with regard to how integrated circuits are fabricated have been challenged in recent years and the semiconductor industry is looking for new solutions. Power and thermal issues add to this apparent crisis in the semiconductor industry. The obvious solution is to deploy fiber optics; which is usually the way to go whenever and wherever there is a bandwidth problem. But fiber optic solutions to on-chip and chip-to-chip interconnection is something that will be hard to develop for commercial chip products. Producing photonic devices that are small enough and inexpensive enough to be used at the chip level is an immensely difficult requirement. In this report, the author analyzes the latest developments in optical interconnection at the chip level and the progress in this area that is being made by important research teams throughout the world. Both R&D and commercial development are discussed. The report looks at this issue from the perspective of classic CPU chips as well as the latest architectures, and the opportunities for optical interconnection are compared to a possible future for metal interconnects and interconnect alternatives that are even more exotic than photonics; carbon nanotubes, especially. The report also contains a 10-year roadmap that explains where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection. Companies Mentioned: - Avago - Cisco - Corning - Dow Chemical - Dow-Corning - DuPont - Finisar - Fujitsu - Furukawa - IBM - Intel - Juniper - Kotura - Micron - Novellus - Optical Interlinks - QD Laser - Reflex Photonics - Samtec - Sumitomo - TeraXion - Tokyo Electron - ULM Photonics - VI Systems For more information visit http://www.researchandmarkets.com/research/kff87c/revenue About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Global Semiconductor Capital Equipment Market to 2016: Lam Research, Tokyo Electron, ASML & Applied Materials Dominate
PR Newswire Europe - Tue Dec 03, 12:00PM CST
DUBLIN, Ireland, December 3, 2013 /PRNewswire/ --
Tokyo Electron Device Announces Release of TB-7VX-690T/-980T/-1140T-PCIEXP Development Test Platforms with Virtex-7 FPGA, Supporting Large-Scale PCI Express Gen3
Business Wire - Tue Nov 19, 7:00AM CST
Tokyo Electron Device Limited (TED) has announced the launch of the new Virtex-7 FPGA evaluation platform; TB-7VX-690T/-980T/-1140T-PCIEXP (TB-7VX-xxxT-PCIEXP, hereinafter) which supports large-scale PCI Express Gen3.
Research and Markets: Global Semiconductor Capital Equipment Market to 2016: Lam Research, Tokyo Electron, ASML & Applied Materials Dominate
Business Wire - Thu Nov 07, 10:56AM CST
Research and Markets (http://www.researchandmarkets.com/research/k7ph66/global) has announced the addition of the "Global Semiconductor Capital Equipment Market 2012-2016" report to their offering.
Global BEOL Wiring Development Equipment Market 2012-2016
M2 - Mon Oct 28, 7:08AM CDT
Research and Markets (http://www.researchandmarkets.com/research/tx8xb6/global_beol) has announced the addition of the "Global BEOL Wiring Development Equipment Market 2012-2016" report to their offering. Global BEOL Wiring Development Equipment Market To Grow At A CAGR Of 1.56 Percent Over The Period 2012-2016 The report provides an in-depth analysis of the global BEOL wiring development equipment market. Commenting on the report, an analyst from researchers' the team said: The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel BEOL wiring development equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers. According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the adoption of mobile devices. Many consumers in the market have been increasingly adopting mobile devices such as cell phones, smartphones, notebook PCs, tablets, Ultrabooks, and PDAs. This increased demand for mobile devices is leading to the increasing demand for BEOL wiring development equipment as it is vital for the functioning of mobile devices. One of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for BEOL wiring development equipment. Moreover, in some cases the production of such equipment tends to exceed its demand. Key Topics Covered 1. Executive Summary 2. Scope of the Report 3. Market Research Methodology 4. List of Abbreviations 5. Introduction 6. Market Landscape 7. Market Segmentation by Type 8. Geographical Segmentation 9. Key Leading Countries 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Trends and their Impact 17. Vendor Landscape 18. Key Vendor Analysis 19. Key Takeaways Companies Mentioned - ASML - Applied Materials - Canon - Dainippon Screen Manufacturing - Ebara - Hitachi High-Technologies - Lam Research - Nikon - Tokyo Electron For more information visit http://www.researchandmarkets.com/research/tx...lobal_beol
New Report Predicts That Chip-Level Optical Interconnect Market Will Generate $520 million in Revenues by 2019
M2 - Mon Oct 21, 6:52AM CDT
Research and Markets (http://www.researchandmarkets.com/research/ghtv86/revenue) has announced the addition of the "Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip" report to their offering. According to this newly released report, the addressable market for chip-level optical interconnects could eventually run into billions of units and revenues in this market will total almost $520 million by 2019 going on to reach $1.02 billion by 2021. The new report is titled Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Volume II: On-Chip and Chip-to-Chip and continues the firm's coverage of this market dating back to 2009. The report covers four kinds of chip-level interconnect: optical engines, photonic integrated circuit (PIC)-based interconnects, silicon photonics and free-space optics. It includes nine-year (volume and value) forecasts with breakouts by active components along with fiber and waveguide transmission media. Compound semiconductor, silicon and polymer waveguides are covered, as are VCSELs, silicon lasers and quantum dot lasers. In addition, the report contains assessments of the latest business and technology strategies in the chip-level optical interconnect space. The growing popularity of parallel computing, and the arrival of multicore processors and 3D chips are leading to data traffic jams both on-chip and chip-to-chip. However, the report believes that these trends are also creating opportunities for chip-level optical interconnects. Avago, Finisar, IBM and Samtec have all proposed optical engines for chip-level interconnect. These miniaturized optical assemblies are currently the most mature technology available for this application and will generate revenues of $235 million in 2019. However, with their attached connectors and heat sinks, optical engines may prove too large for complex optical interconnection environments, such as in the coming generation of Exascale supercomputers. Because of the limitations of optical engines, there are emerging opportunities for compact PIC- based interconnect devices based on indium phosphide and gallium arsenide. The author says these opportunities will generate $120 million in 2019 increasing to $275 million by 2021. However, bonding PIC interconnects onto a silicon processor or memory chip is both technically challenging and expensive. So far, only a few PIC and VCSEL technology companies have pursued the interconnect opportunity. Companies Mentioned: - Avago - Cisco - Corning - Dow Chemical - Dow-Corning - DuPont - Finisar - Fujitsu - Furukawa - IBM - Intel - Juniper - Kotura - Micron - Novellus - Optical Interlinks - QD Laser - Reflex Photonics - Samtec - Sumitomo - TeraXion - Tokyo Electron - ULM Photonics - VI Systems For more information visit http://www.researchandmarkets.com/research/ghtv86/revenue About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Research and Markets: Global Semiconductor Wafer Cleaning Systems Market 2012-2016 with Lam research, Tokyo Electron & Dainippon Screen Manufacturing Dominating
Business Wire - Tue Oct 15, 4:56AM CDT
Research and Markets (http://www.researchandmarkets.com/research/66lpb7/global) has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2012-2016" report to their offering.
Global Semiconductor Wafer Cleaning Systems Market 2012-2016 with Lam research, Tokyo Electron & Dainippon Screen Manufacturing Dominating
M2 - Tue Oct 15, 3:59AM CDT
Research and Markets (http://www.researchandmarkets.com/research/t249cl/global) has announced the addition of the "Global Semiconductor Wafer Cleaning Systems Market 2012-2016" report to their offering. Global Semiconductor Wafer Cleaning Systems market to grow at a CAGR of 15.92 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing demand for smartphones and tablets. The Global Semiconductor Wafer Cleaning Systems market has also been witnessing an increase in collaborations. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market. According to the report, the biggest factor contributing to the growth of the market is the rising demand for smartphones and tablets. The growing demand for these devices is primarily due to the increasing adoption of these devices in emerging markets. Therefore, this rising demand has subsequently created more demand for semiconductor wafers, thus driving the growth of the Global Semiconductor Wafer Cleaning Systems market. Further, the report states that the most bothering issue for the market is the cyclical nature of the Semiconductor industry. The wafer cleaning equipment manufacturers often experience fluctuating revenues as a result of the unstable market condition, which in turn adversely affects profitability. The key vendors dominating this space include: - Dainippon Screen Manufacturing Co. Ltd. - Lam Research Corp. - Tokyo Electron Ltd. The other vendors mentioned in this report are: - Akrion Systems LLC - Axcelis Technologies Inc. - FSI International Inc. - GlobalFoundries Inc. - SEMES Co. Ltd. - Samsung Electronics Co. Ltd. - Semiconductor Manufacturing International Corp. - Taiwan Semiconductor Manufacturing Co. Ltd. - United Microelectronics Corp. Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Introduction 04. Market Research Methodology 05. Scope of the Report 06. Market Landscape 07. Geographical Segmentation 08. Key Leading Countries 09. Vendor Landscape 10. Buying Criteria 11. Market Growth Drivers 12. Drivers and their Impact 13. Market Challenges 14. Impact of Drivers and Challenges 15. Market Trends 16. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/t249cl/global
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