Latest Stats Chippac Ltd (SCIPF) Headlines
STATS ChipPAC's fcCuBE Technology Achieves Significant Growth in 2013
Marketwire - Tue Feb 25, 3:01PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that unit shipments of semiconductor packages utilising the Company's patented fcCuBE(R) technology more than quadrupled in 2013 compared to 2012. The performance and cost advantages of this advanced flip chip packaging technology has driven adoption by customers in the mobile, consumer and cloud computing markets.
The Multi-Component IC Packaging Market 2014 Edition
M2 - Tue Feb 25, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/6v7pwk/the) has announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" report to their offering. Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game changers for the industry. It is the package of the integrated circuit (IC) which holds the footprint to the printed circuit board (PCB), and thus it is the IC package which has enabled the multitude of small, handheld electronics to be invented and proliferate in today's world. It is not just small size, but the added performance with high speed, more functionality, and the ability for handheld electronics to communicate via the Internet so that anyone with a smart phone or tablet has a wealth of information at their fingertips. The costs per transistor is now going up with advancing technology nodes of 22nm and 14nm, when traditionally the cost goes down. Increasingly the backend, or IC packaging, is being looked at a meeting the needs of tomorrow's technology demands rather than the front end manufacturing. Key Topics Covered: Chapter 1: Introduction 1.1 Background 1.2 Scope 1.3 Organization 1.4 Methodology Chapter 2: Executive Summary 2.1 Overview 2.2 Stacked Packages 2.3 Through-Vias Technology, 2-5D, and 3-D Interconnection Solutions 2.4 System in Package Chapter 3: Stacked Packages 3.1 Overview 3.2 Types of Stacked Packages 3.3 The Ins and Outs of Stacked Packages 3.4 Interconnection 3.5 Stacked Package as a Multi-Component Package 3.6 Wafer Thinning 3.7 End Markets and Application Trends 3.8 New Product Introductions 3.9 Unit and Revenue Forecasts Chapter 4: Through Vias, 3-D and 2.5-D Integration 4.1 Through Vias and 3-D Overview 4.2 2.5-D 4.3 2.5-D Interposers and Microbumps 4.4 Wide I/O 4.5 Creating the Vias 4.6 Who Takes Ownership of each Process Steps? 4.7 What does it Cost to Create 2.5-D and 3-D Devices 4.8 Issues / Solutions / Call to Action 4.9 3-D Die-Stacking Technology Requirements 4.10 Bonding Methods 4.11 Via First, Middle, or Last Technology 4.12 Via Etching and Filling 4.13 New Product/Process Highlights 4.14 Industry Consortiums 4.15 Market Potential 4.16 Future Markets 4.17 TSV Forecasts (2.5-D, 3-D, Interposer) Chapter 5: System in Package 5.1 Overview 5.2 Hybrid Memory Cube 5.3 New Product Introductions/Highlights 5.5 SiP Forecasts Companies Mentioned - 3D Glass Solutions - APSTL, llc - Auburn University - CEA-Leti - Cisco, Inc. and Amkor Technology - Corning, Inc. Dow Chemical - EV Group - Fraunhofer Institute for Reliability and Microintegration - Fujikura Ltd. and FlipChip International, LLC - Innovative Micro Technology - Kyocera America - Nanyang Technology University - Sandia National Laboratories - SET North America and RTI International CMET - Shinko Electric Industries - STATS ChipPAC Ltd. - SUNY College, College of Nanoscale Science and Engineering - SUSS MicroTec - Texas Instruments - Tohoku University - Triton Micro Technologies, Inc. and nMode Solutions - Unimicron Technology Corporation and ITRI For more information visit http://www.researchandmarkets.com/research/6v7pwk/the
Global 3D ICs Market to 2019: MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED
M2 - Thu Feb 20, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/35kchv/3d_ics_market) has announced the addition of the "3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" report to their offering. The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide. This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019. The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments. Scope End-Use Sectors - Consumer electronics - Information and communication technology - Transport (automotive and aerospace) - Military - Others (Biomedical applications and R&D) Substrate Type: - Silicon on insulator(SOI) - Bulk Silicon Fabrication Process: - Beam re-crystallization - Wafer bonding - Silicon epitaxial growth - Solid phase crystallization Product - MEMS and Sensor - RF SiP - Optoelectronics and imaging - Memories (3D Stacks) - Logic (3D Sip/Soc) - HB LED Key Topics Covered: Chapter 1 Preface Chapter 2 Executive Summary Chapter 3 3D ICs Market Overview Chapter 4 Global 3D ICs Market, by End-Use Industry Chapter 5 Global 3D ICs Market, by Substrate Type Chapter 6 Global 3D ICs Market, by Fabrication Process Chapter 7 Global 3D ICs Market, by Product Chapter 8 Global 3D ICs Market, by Geography Chapter 9 Company Profiles - Elpida Memory, Inc. (Micron Technology, Inc.) - MonolithIC 3D Inc. - STATS ChipPAC Ltd. - Taiwan Semiconductor Manufacturing Company, Ltd. - Tezzaron Semiconductor Corporation - The 3M Company - United Microelectronics Corporation - XILINX, Inc. - Ziptronix, Inc. For more information visit http://www.researchandmarkets.com/research/35kchv/3d_ics_market
TicketNetwork.com Concert Roundup: Elton John, Kanye West, One Direction Among Upcoming Tours
Marketwire - Fri Jan 31, 9:00AM CST
As January turns into February, the 2014 concert season is beginning to pick up. Various tours from artists such as George Strait and One Direction are scheduled to begin within the next six months.
STATS ChipPAC Reports Fourth Quarter and Full Year 2013 Results
Marketwire - Wed Jan 29, 3:35AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the fourth quarter and full year 2013.
Demand for High Speed IC Packaging Solutions Drives the Market for Flip-Chip, According to a New Trend Report Published by Global Industry Analysts, Inc.
PRWeb - Thu Jan 23, 8:57AM CST
Follow us on LinkedIn - Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods. Key benefits of the Flip-Chip technology driving its adoption include reduced signal inductance, higher signal density and reduced package footprint.
STATS ChipPAC Recognised for Patent Innovations for the Third Consecutive Year by IEEE
Marketwire - Tue Jan 21, 3:00PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the third consecutive year among the world's top 20 semiconductor manufacturing companies in the 2013 Patent Power Scorecard published by IEEE Spectrum, the flagship magazine of the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm.
STATS ChipPAC Schedules Fourth Quarter and Full Year 2013 Results Conference Call
Marketwire - Wed Jan 15, 3:35AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Thursday, 30 January 2014 at 8:00 a.m. in Singapore to discuss the Company's results for the fourth quarter and full year 2013 and business outlook for the first quarter 2014.
3-D TSV: Insight On Critical Issues And Market Analysis
M2 - Thu Nov 21, 2:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/k7krcb/3d_tsv_insight) has announced the addition of the "3-D TSV: Insight On Critical Issues And Market Analysis" report to their offering. TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction. This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips. The TSV process, which is more complex than initially anticipated, is now beginning to enter production. Key Topics Covered: Chapter 1 Introduction Chapter 2 Insight Into Critical Issues Chapter 3 Cost Structure Chapter 4 Critical Processing Technologies Chapter 5 Evaluation Of Critical Development Segments Chapter 6 Profiles Of Participants Chapter 7 Market Analysis LIST OF TABLES LIST OF FIGURES Companies Mentioned - A*STAR - BeSang - CEA-Leti - Dai Nippon Printing - EMC3D - Fraunhofer IZM - IBM - Jazz Semiconductor - KAIST - Lam Research - Micron Technology - NEC - Oki Electric - PVA TePLA - Renesas - STATS ChipPAC - TSMC - UMC - WRS Materials - Ziptronix - austriamicrosystems and many more.. For more information visit http://www.researchandmarkets.com/research/k7krcb/3d_tsv_insight About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
STATS ChipPAC Reports Third Quarter 2013 Results
Marketwire - Wed Nov 06, 3:30AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the third quarter 2013.
Worldwide Semiconductor Assembly and Test Services Market to 2016
M2 - Fri Oct 25, 8:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/fjtnff/global) has announced the addition of the "Worldwide Semiconductor Assembly and Test Services Market to 2016" report to their offering. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. The key vendors dominating this space include: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. Key questions answered in this report: - What will the market size be in 2016 and what will be the growth rate? - What are key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by key vendors? - What are the strengths and weaknesses of each of these key vendors? Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Introduction 04. Market Research Methodology 05. Scope of the Report 06. Market Landscape 07. Geographical Segmentation 08. Vendor Landscape 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/fjtnff/global
STATS ChipPAC Schedules Third Quarter 2013 Results Conference Call
Marketwire - Fri Oct 18, 4:35AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Thursday, 7 November 2013 at 8:00 a.m. in Singapore to discuss the Company's results for the third quarter 2013 and business outlook for the fourth quarter 2013.
STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging
Marketwire - Mon Aug 19, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced a new milestone in reducing Package-on-Package (PoP) height with its ultra thin embedded Wafer Level Ball Grid Array (eWLB) technology. STATS ChipPAC has pursued innovative advances in embedded packaging design methodology, process enhancements and cost structure to deliver eWLB-based PoP solutions with an ultra thin package profile height of 0.3mm.
STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies
Marketwire - Mon Aug 12, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced a collaborative partnership with Nanyang Technological University (NTU) focused on generating breakthrough innovations in next generation packaging technologies.
STATS ChipPAC Reports Second Quarter 2013 Results
Marketwire - Tue Aug 06, 4:32AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the second quarter 2013.
Advantest Earns Best Supplier Award From STATS ChipPAC
Marketwire - Wed Jul 31, 2:05AM CDT
Semiconductor test equipment leader Advantest Corporation (TSE: 6857) (NYSE: ATE) has received the Best Supplier Award from Singapore-based STATS ChipPAC Ltd. (SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services. Advantest won this year's award by unanimous decision of the judges and now has earned this supplier recognition every year since 2007.
Embedded IC & Die Technologies Patent Market Analysis & Survey Report Now Available at ReportsnReports.com
PRWeb - Tue Jul 30, 6:14AM CDT
The report provides a deep dive into each of the patent portfolios including SEMCO, ASE, Samsung, Unimicron, Intel, Imbera, Shinko, Murata, LG Innotek and Daeduck. For each of these companies, the report provides an in-depth analysis of the patent portfolio, highlighting the following points: company profile, company patent portfolio evolution, countries of deposition and origin of the patents, top inventors, technical segmentation of each patent portfolio, patent portfolio analysis for each manufacturing process step and architecture and main technical innovations. This analysis by company provides an in-depth view of the strengths and weaknesses of each patent portfolio and of the developments now implemented by each company.
STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support
Marketwire - Mon Jul 22, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its sixth annual Supplier Awards, honouring the Company's top suppliers in recognition of their excellent performance and outstanding support in 2012. The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovation for STATS ChipPAC and its customers. Supplier partnerships are evaluated on multiple criteria including technology, quality, delivery, responsiveness, service and cost competiveness.
STATS ChipPAC Schedules Second Quarter 2013 Results Conference Call
Marketwire - Thu Jul 18, 4:35AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Wednesday, 7 August 2013 at 8:00 a.m. in Singapore to discuss the Company's results for the second quarter 2013 and business outlook for the third quarter 2013.
STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone
Marketwire - Mon Jul 01, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced that it has been granted its 1,000th patent by the U.S. Patent and Trademark Office (USPTO).
STATS ChipPAC's fcCuBE Technology Achieves Significant Growth in 2013
Marketwire - Tue Feb 25, 3:01PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that unit shipments of semiconductor packages utilising the Company's patented fcCuBE(R) technology more than quadrupled in 2013 compared to 2012. The performance and cost advantages of this advanced flip chip packaging technology has driven adoption by customers in the mobile, consumer and cloud computing markets.
The Multi-Component IC Packaging Market 2014 Edition
M2 - Tue Feb 25, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/6v7pwk/the) has announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" report to their offering. Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game changers for the industry. It is the package of the integrated circuit (IC) which holds the footprint to the printed circuit board (PCB), and thus it is the IC package which has enabled the multitude of small, handheld electronics to be invented and proliferate in today's world. It is not just small size, but the added performance with high speed, more functionality, and the ability for handheld electronics to communicate via the Internet so that anyone with a smart phone or tablet has a wealth of information at their fingertips. The costs per transistor is now going up with advancing technology nodes of 22nm and 14nm, when traditionally the cost goes down. Increasingly the backend, or IC packaging, is being looked at a meeting the needs of tomorrow's technology demands rather than the front end manufacturing. Key Topics Covered: Chapter 1: Introduction 1.1 Background 1.2 Scope 1.3 Organization 1.4 Methodology Chapter 2: Executive Summary 2.1 Overview 2.2 Stacked Packages 2.3 Through-Vias Technology, 2-5D, and 3-D Interconnection Solutions 2.4 System in Package Chapter 3: Stacked Packages 3.1 Overview 3.2 Types of Stacked Packages 3.3 The Ins and Outs of Stacked Packages 3.4 Interconnection 3.5 Stacked Package as a Multi-Component Package 3.6 Wafer Thinning 3.7 End Markets and Application Trends 3.8 New Product Introductions 3.9 Unit and Revenue Forecasts Chapter 4: Through Vias, 3-D and 2.5-D Integration 4.1 Through Vias and 3-D Overview 4.2 2.5-D 4.3 2.5-D Interposers and Microbumps 4.4 Wide I/O 4.5 Creating the Vias 4.6 Who Takes Ownership of each Process Steps? 4.7 What does it Cost to Create 2.5-D and 3-D Devices 4.8 Issues / Solutions / Call to Action 4.9 3-D Die-Stacking Technology Requirements 4.10 Bonding Methods 4.11 Via First, Middle, or Last Technology 4.12 Via Etching and Filling 4.13 New Product/Process Highlights 4.14 Industry Consortiums 4.15 Market Potential 4.16 Future Markets 4.17 TSV Forecasts (2.5-D, 3-D, Interposer) Chapter 5: System in Package 5.1 Overview 5.2 Hybrid Memory Cube 5.3 New Product Introductions/Highlights 5.5 SiP Forecasts Companies Mentioned - 3D Glass Solutions - APSTL, llc - Auburn University - CEA-Leti - Cisco, Inc. and Amkor Technology - Corning, Inc. Dow Chemical - EV Group - Fraunhofer Institute for Reliability and Microintegration - Fujikura Ltd. and FlipChip International, LLC - Innovative Micro Technology - Kyocera America - Nanyang Technology University - Sandia National Laboratories - SET North America and RTI International CMET - Shinko Electric Industries - STATS ChipPAC Ltd. - SUNY College, College of Nanoscale Science and Engineering - SUSS MicroTec - Texas Instruments - Tohoku University - Triton Micro Technologies, Inc. and nMode Solutions - Unimicron Technology Corporation and ITRI For more information visit http://www.researchandmarkets.com/research/6v7pwk/the
Global 3D ICs Market to 2019: MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED
M2 - Thu Feb 20, 10:13AM CST
Research and Markets (http://www.researchandmarkets.com/research/35kchv/3d_ics_market) has announced the addition of the "3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" report to their offering. The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide. This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019. The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments. Scope End-Use Sectors - Consumer electronics - Information and communication technology - Transport (automotive and aerospace) - Military - Others (Biomedical applications and R&D) Substrate Type: - Silicon on insulator(SOI) - Bulk Silicon Fabrication Process: - Beam re-crystallization - Wafer bonding - Silicon epitaxial growth - Solid phase crystallization Product - MEMS and Sensor - RF SiP - Optoelectronics and imaging - Memories (3D Stacks) - Logic (3D Sip/Soc) - HB LED Key Topics Covered: Chapter 1 Preface Chapter 2 Executive Summary Chapter 3 3D ICs Market Overview Chapter 4 Global 3D ICs Market, by End-Use Industry Chapter 5 Global 3D ICs Market, by Substrate Type Chapter 6 Global 3D ICs Market, by Fabrication Process Chapter 7 Global 3D ICs Market, by Product Chapter 8 Global 3D ICs Market, by Geography Chapter 9 Company Profiles - Elpida Memory, Inc. (Micron Technology, Inc.) - MonolithIC 3D Inc. - STATS ChipPAC Ltd. - Taiwan Semiconductor Manufacturing Company, Ltd. - Tezzaron Semiconductor Corporation - The 3M Company - United Microelectronics Corporation - XILINX, Inc. - Ziptronix, Inc. For more information visit http://www.researchandmarkets.com/research/35kchv/3d_ics_market
TicketNetwork.com Concert Roundup: Elton John, Kanye West, One Direction Among Upcoming Tours
Marketwire - Fri Jan 31, 9:00AM CST
As January turns into February, the 2014 concert season is beginning to pick up. Various tours from artists such as George Strait and One Direction are scheduled to begin within the next six months.
STATS ChipPAC Reports Fourth Quarter and Full Year 2013 Results
Marketwire - Wed Jan 29, 3:35AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the fourth quarter and full year 2013.
Demand for High Speed IC Packaging Solutions Drives the Market for Flip-Chip, According to a New Trend Report Published by Global Industry Analysts, Inc.
PRWeb - Thu Jan 23, 8:57AM CST
Follow us on LinkedIn - Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods. Key benefits of the Flip-Chip technology driving its adoption include reduced signal inductance, higher signal density and reduced package footprint.
STATS ChipPAC Recognised for Patent Innovations for the Third Consecutive Year by IEEE
Marketwire - Tue Jan 21, 3:00PM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the third consecutive year among the world's top 20 semiconductor manufacturing companies in the 2013 Patent Power Scorecard published by IEEE Spectrum, the flagship magazine of the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm.
STATS ChipPAC Schedules Fourth Quarter and Full Year 2013 Results Conference Call
Marketwire - Wed Jan 15, 3:35AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Thursday, 30 January 2014 at 8:00 a.m. in Singapore to discuss the Company's results for the fourth quarter and full year 2013 and business outlook for the first quarter 2014.
3-D TSV: Insight On Critical Issues And Market Analysis
M2 - Thu Nov 21, 2:39AM CST
Research and Markets (http://www.researchandmarkets.com/research/k7krcb/3d_tsv_insight) has announced the addition of the "3-D TSV: Insight On Critical Issues And Market Analysis" report to their offering. TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction. This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips. The TSV process, which is more complex than initially anticipated, is now beginning to enter production. Key Topics Covered: Chapter 1 Introduction Chapter 2 Insight Into Critical Issues Chapter 3 Cost Structure Chapter 4 Critical Processing Technologies Chapter 5 Evaluation Of Critical Development Segments Chapter 6 Profiles Of Participants Chapter 7 Market Analysis LIST OF TABLES LIST OF FIGURES Companies Mentioned - A*STAR - BeSang - CEA-Leti - Dai Nippon Printing - EMC3D - Fraunhofer IZM - IBM - Jazz Semiconductor - KAIST - Lam Research - Micron Technology - NEC - Oki Electric - PVA TePLA - Renesas - STATS ChipPAC - TSMC - UMC - WRS Materials - Ziptronix - austriamicrosystems and many more.. For more information visit http://www.researchandmarkets.com/research/k7krcb/3d_tsv_insight About Research and Markets Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
STATS ChipPAC Reports Third Quarter 2013 Results
Marketwire - Wed Nov 06, 3:30AM CST
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the third quarter 2013.
Worldwide Semiconductor Assembly and Test Services Market to 2016
M2 - Fri Oct 25, 8:30AM CDT
Research and Markets (http://www.researchandmarkets.com/research/fjtnff/global) has announced the addition of the "Worldwide Semiconductor Assembly and Test Services Market to 2016" report to their offering. According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors. Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry. The key vendors dominating this space include: - Advanced Semiconductor Engineering Inc. - Amkor Technology Inc. - Siliconware Precision Industries Co. Ltd. - STATS ChipPAC Ltd. Key questions answered in this report: - What will the market size be in 2016 and what will be the growth rate? - What are key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by key vendors? - What are the strengths and weaknesses of each of these key vendors? Key Topics Covered: 01. Executive Summary 02. List of Abbreviations 03. Introduction 04. Market Research Methodology 05. Scope of the Report 06. Market Landscape 07. Geographical Segmentation 08. Vendor Landscape 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Key Vendor Analysis For more information visit http://www.researchandmarkets.com/research/fjtnff/global
STATS ChipPAC Schedules Third Quarter 2013 Results Conference Call
Marketwire - Fri Oct 18, 4:35AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Thursday, 7 November 2013 at 8:00 a.m. in Singapore to discuss the Company's results for the third quarter 2013 and business outlook for the fourth quarter 2013.
STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging
Marketwire - Mon Aug 19, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced a new milestone in reducing Package-on-Package (PoP) height with its ultra thin embedded Wafer Level Ball Grid Array (eWLB) technology. STATS ChipPAC has pursued innovative advances in embedded packaging design methodology, process enhancements and cost structure to deliver eWLB-based PoP solutions with an ultra thin package profile height of 0.3mm.
STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies
Marketwire - Mon Aug 12, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced a collaborative partnership with Nanyang Technological University (NTU) focused on generating breakthrough innovations in next generation packaging technologies.
STATS ChipPAC Reports Second Quarter 2013 Results
Marketwire - Tue Aug 06, 4:32AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results for the second quarter 2013.
Advantest Earns Best Supplier Award From STATS ChipPAC
Marketwire - Wed Jul 31, 2:05AM CDT
Semiconductor test equipment leader Advantest Corporation (TSE: 6857) (NYSE: ATE) has received the Best Supplier Award from Singapore-based STATS ChipPAC Ltd. (SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services. Advantest won this year's award by unanimous decision of the judges and now has earned this supplier recognition every year since 2007.
Embedded IC & Die Technologies Patent Market Analysis & Survey Report Now Available at ReportsnReports.com
PRWeb - Tue Jul 30, 6:14AM CDT
The report provides a deep dive into each of the patent portfolios including SEMCO, ASE, Samsung, Unimicron, Intel, Imbera, Shinko, Murata, LG Innotek and Daeduck. For each of these companies, the report provides an in-depth analysis of the patent portfolio, highlighting the following points: company profile, company patent portfolio evolution, countries of deposition and origin of the patents, top inventors, technical segmentation of each patent portfolio, patent portfolio analysis for each manufacturing process step and architecture and main technical innovations. This analysis by company provides an in-depth view of the strengths and weaknesses of each patent portfolio and of the developments now implemented by each company.
STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support
Marketwire - Mon Jul 22, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its sixth annual Supplier Awards, honouring the Company's top suppliers in recognition of their excellent performance and outstanding support in 2012. The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovation for STATS ChipPAC and its customers. Supplier partnerships are evaluated on multiple criteria including technology, quality, delivery, responsiveness, service and cost competiveness.
STATS ChipPAC Schedules Second Quarter 2013 Results Conference Call
Marketwire - Thu Jul 18, 4:35AM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Wednesday, 7 August 2013 at 8:00 a.m. in Singapore to discuss the Company's results for the second quarter 2013 and business outlook for the third quarter 2013.
STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone
Marketwire - Mon Jul 01, 4:00PM CDT
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced that it has been granted its 1,000th patent by the U.S. Patent and Trademark Office (USPTO).
