NoMIS Power Achieves Milestone in Silicon Carbide Innovation
The U.S. Department of Energy's (DOE) latest initiative marks a significant advancement in semiconductor packaging technology, driven by the innovative team at NoMIS Power. They have been recognized as one of eight winners in the first phase of the American-Made Silicon Carbide (SiC) Packaging Prize, a highly competitive program aimed at revolutionizing semiconductor innovation.
Securing the Phase 1 Win
NoMIS Power’s achievement includes a financial reward of $50,000 for their groundbreaking proposal to develop what they term a "chip-scale" packaging solution. This design is not only aimed at simplifying assembly processes but also focuses on enhancing reliability and delivering superior performance in high-power applications.
The Power of SiC Technology
At the heart of their innovative approach are novel metal-core substrates integrated with robust SiC power MOSFETs. With ratings of 1.2 kV and 3.3 kV, these components are set to significantly outperform current packaging technologies in terms of efficiency, scalability, and cost. This leap in technology will be especially beneficial for power conversion systems serving advanced fields such as artificial intelligence and high-performance computing.
The Vision of Collaboration
Dr. Adam Morgan, co-founder and CEO of NoMIS Power, expressed enthusiasm about the collaboration with partners Lux Semiconductors, QP Technologies, and the University of Arkansas. He believes that their combined technology and expertise will pave the way for efficient manufacturing and speed up the pathway towards commercialization of their prototypes.
Looking Ahead to Phase 2
Progressing to Phase 2, the NoMIS Power team is set to refine its prototypes and will undergo extensive testing at the Oak Ridge National Laboratory. The goal is to secure one of four coveted places in Phase 3 that comes with an additional $250,000 grant. The team is keen on demonstrating how their technology can meet the complex specifications required in modern power systems and further promote the adoption of SiC technologies.
Funding and Support from DOE
The SiC Packaging Prize is a significant initiative funded by the DOE's Office of Electricity and is managed by the National Renewable Energy Laboratory. This program is designed to stimulate collaboration between entrepreneurs and national laboratories to foster essential advancements in energy technology.
Exciting Developments for NoMIS Power
NoMIS Power's flagship products, including the 1.2 kV SiC power modules and the next-generation 3.3 kV SiC power MOSFETs, are set to make a debut soon. The company is preparing to showcase these cutting-edge solutions at key industry events, including APEC in March and PCIM in May. These launches represent a significant stride toward addressing the energy demands across various sectors.
About NoMIS Power
NoMIS Power Corporation specializes in designing and developing innovative Silicon Carbide power semiconductor devices and advanced packaging architectures in the U.S. Established in 2020, the company emerged from the University at Albany's College of Nanotechnology, Science, and Engineering, focusing on providing revolutionary solutions for global power electronics markets.
For more details about their offerings, please visit www.nomispower.com.
Frequently Asked Questions
What milestone did NoMIS Power achieve?
NoMIS Power advanced to Phase 2 in the American-Made Silicon Carbide Packaging Prize.
What financial support did NoMIS Power receive?
The company received $50,000 as a Phase 1 winner of the prize for its innovative proposal.
What technology is NoMIS Power developing?
The company is working on a "chip-scale" packaging solution incorporating metal-core substrates and SiC power MOSFETs.
What are the anticipated applications of NoMIS's technologies?
NoMIS's innovations are expected to enhance power systems in sectors such as AI, high-performance computing, and renewable energy sources.
Where will NoMIS Power showcase its products?
The upcoming launches will be showcased at APEC and PCIM, significant events in the semiconductor industry.
