Teledyne Chooses onsemi's Treo for Cutting-Edge Imaging Tech
Teledyne Technologies Partners with onsemi's Treo Platform
onsemi has recently announced an exciting collaboration with Teledyne Technologies, taking a significant leap forward in the realm of infrared imaging systems. This partnership will leverage onsemi's Treo platform to develop cutting-edge application-specific integrated circuits (ASICs) for next-generation readout integrated circuits (ROIC). Recognized as one of the industry’s leading analog and mixed-signal platforms, Treo allows the integration of specialized ROIC modules, effectively addressing the growing needs of infrared focal plane array (FPA) systems utilized in various fields such as aerospace, defense, and scientific research.
Advancements in Technology Through the Treo Platform
Built on a state-of-the-art 65nm node, the Treo platform is designed with a modular architecture embedded with an extensive set of intellectual property (IP) building blocks. This innovative design significantly accelerates the development process and minimizes the time taken to bring products to market. By integrating onsemi’s verified ROIC technology with Treo's precision analog capabilities, advanced digital features, and low-voltage power management, this platform delivers a robust, differentiated solution tailored for high-performance applications.
Key Functionalities of the Treo Platform
The defining characteristics of the Treo platform include:
- Enhanced gate density enabling increased functionality within a compact footprint, which optimizes overall performance while minimizing size.
- Reduced power consumption, contributing to improved efficiency and longer operational lifespans for devices.
- High-density on-chip energy storage that supports larger detector arrays without expanding die size, ensuring excellent signal integrity.
- Low resistivity substrates, enhancing resilience against radiation, thereby benefiting applications in space and defense sectors.
- A broad operational temperature range, ensuring reliability across various extreme environments, from cryogenic conditions to demanding automotive temperatures.
- Die stitching technology to accommodate large-format sensor configurations, further refining advanced imaging systems.
These incredible features enable Teledyne to develop imaging systems that are not only smaller and faster but also more dependable. These systems are capable of performing mission-critical activities in challenging environments.
Teledyne’s Vision for Advanced Imaging Systems
Anders Petersen, the Chief Engineer and Fellow at Teledyne Imaging Sensors, emphasized the necessity of high-performance imaging sensors designed for extreme environmental resilience. He stated, “The onsemi Treo platform empowers us to enhance functionality within a more compact design while ensuring lower power requirements crucial for thermal management. These elements are vital to crafting our future infrared imaging systems.
The Role of onsemi in Advancing Innovation
Michel De Mey, Vice President of the Sensor Interface Division at onsemi, also highlighted the platform’s capabilities. He explained how onsemi's modular architecture paired with a rich library of trusted IP blocks is instrumental in accelerating innovation. This fusion enables swift development of custom ROICs, streamlining the integration of precision analog and digital functionalities. Thus, Treo proves to be the ideal foundation for Teledyne's forthcoming infrared imaging innovations.
Domestic Chip Manufacturing and National Security
Manufactured at onsemi's facility in East Fishkill, New York, the Treo platform is equipped with Category 1A Trusted Supplier accreditation. This status aligns with the pressing need for domestic semiconductor manufacturing, crucial for supporting national security interests. This move is more than just business; it reflects a commitment to advancing technological solutions that meet governmental and societal requirements.
About onsemi
onsemi (NASDAQ: ON) is at the forefront of generating disruptive innovations aimed at creating a sustainable future. By concentrating on automotive and industrial sectors, the company is driving significant changes in megatrends like electric vehicles, sustainable energy systems, industrial automation, and 5G infrastructure. The company boasts a diverse and innovative portfolio, providing intelligent power and sensing technologies that tackle some of the world's most intricate challenges, contributing to a safer, cleaner, and smarter planet.
.Frequently Asked Questions
What is the Treo platform?
The Treo platform is an advanced analog and mixed-signal platform developed by onsemi, designed for high-performance application-specific integrated circuits used in infrared imaging systems.
What are the benefits of using the Treo platform for Teledyne?
The Treo platform enhances functionality, reduces power consumption, and enables smaller, more efficient designs vital for advanced infrared imaging systems.
How does onsemi support national security?
onsemi’s East Fishkill, NY facility holds a Category 1A Trusted Supplier accreditation, which positions the company to meet domestic chip manufacturing needs critical for national security.
What industries benefit from the Treo platform?
The Treo platform supports various industries including aerospace, defense, healthcare, and scientific research, providing necessary technologies for their imaging systems.
How does the partnership enhance imaging technology?
The partnership allows for rapid, innovative development of custom ROICs while seamlessly integrating precision functionalities, making it ideal for the demands of high-performance imaging.
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