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EP Global Communications I EPGL
Posted On: 06/05/2013 1:11:45 AM
Post# of 1422
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Posted By: steelerfan7


Ultra Flexible Substrate



Phase 2 SBIR



Agency: Defense Advanced Research Projects Agency

Topic: SB031-019

Budget: 08/23/04 - 11/30/06

PI: Dr. David T. Markus


Sarcos has worked on the development of a new technology that enables electronic devices to be fabricated on filamentary and elongated prismatic flexible substrates which can then be interconnected to form large area and even volumetric flexible electronic and multi-regime systems. As part of the phase I effort we have analytically developed new...






$98.9K



Ultra Flexible Substrate



Phase 1 SBIR



Agency: Defense Advanced Research Projects Agency

Topic: SB031-019

Budget: 06/10/03 - 02/11/04

PI: Dr. David T. Markus


Current microelectronics relies on silicon substrate, ceramic packaging and fiber glass circuit board, devices built using this technology is costly and not flexible. Although foils (such as polyimide or steel) promised to address flexibility, they have to be very thin. Sarcos has been working on a revolutionary technology that will enable elect...















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