Posted On: 05/01/2013 9:24:35 AM
Post# of 145123
XSNX >>Company Highlights
Capital-efficient turn-key thin-film manufacturing technology
Low-cost production, high throughput, low Total-Cost-Of-Ownership
156 mm stainless steel substrates for better processes and higher yields
Fully integrated with state-of-the-art software and controls
10 MW, 20 MW, 50 MW, and 100 MW scalable lines
Combination of the best of sputtering and thermal co-evaporation deposition on small area devices to achieve the high conversion efficiencies that national laboratories.
Patent-pending CIGS Thermal Deposition System
Equipped with proprietary CIGS thermal effusion sources (HTE)
Proprietary buffer deposition systems
Long term, aggressive Technology Roadmap and Support
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