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Posted On: 01/20/2022 3:09:29 PM
Post# of 94266
$GTCH continuation patent application seeks to expand the protection of multi-dimensional integrated circuits architecture and semiconductor wafers mounted on the multi-dimensional planes
SAN DIEGO, Jan. 20, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), filed a continuation patent application for its 3D, multiplanar, integrated circuits (IC) design and manufacturing technology. The original invention design presents a new way to design and manufacture larger size ICs to fit advanced analog, digital and mixed type ICs on a silicon wafer. The goal of these methods is to enable advanced microchip’s design and manufacturing within less space which can be a significant factor particularly for memories, CPU, GPU, AI chips and more. The company’s 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020 by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763. The continuation application, assigned number 17102928, was filed on November 24, 2020 and seeks to broaden the protection of the main IP concepts. It is GBT’s goal to allow for further advancements in circuitries connections and wiring through the use of the 3D, multidimensional design utilizing more space on the silicon wafer.
SAN DIEGO, Jan. 20, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), filed a continuation patent application for its 3D, multiplanar, integrated circuits (IC) design and manufacturing technology. The original invention design presents a new way to design and manufacture larger size ICs to fit advanced analog, digital and mixed type ICs on a silicon wafer. The goal of these methods is to enable advanced microchip’s design and manufacturing within less space which can be a significant factor particularly for memories, CPU, GPU, AI chips and more. The company’s 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020 by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763. The continuation application, assigned number 17102928, was filed on November 24, 2020 and seeks to broaden the protection of the main IP concepts. It is GBT’s goal to allow for further advancements in circuitries connections and wiring through the use of the 3D, multidimensional design utilizing more space on the silicon wafer.
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