$GTCH The patent contemplates placing more circuits on silicon within small areas, which is expected to enable sophisticated chips particularly with memories, CPU, GPU and more. The method contemplated by the patent application enables lowering the overall IC's power consumption and increasing its performance. The company’s 3D microchip patent was filed on March 5, 2019 and was granted as of December 1, 2020 by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763.

“We decided to protect our intellectual property by filing international PCT protection in South Korea and Europe. Our 3D microchip patent was granted as of December 1, 2020 by the USPTO. We filed for this patent on March 5, 2019.” stated Dr. Danny Rittman, the Company’s CTO.