$GTCH From a recent release: "We are glad to announce that we will be granted our multi-planer microchip patent on December 1, 2020," said Danny Rittman, GBT’s CTO. "By manufacturing honeycomb, hexagonal and other multi planer structural shapes die, we believe IC design houses will be able to increase their silicon surface for transistors. Especially when it comes to memory circuits, silicon real-estate is a key factor. As more we can place on the silicon, as better, given reasonable, affordable die size. We believe the invention will enable to design and manufacture gigantic chips for all design processes including advanced nodes like 10nm, 7nm, 5nm and below."