$POETR $POET So what is Poet's OI packaging solution advantage?

Three Approaches to Optical Engine / Transceiver Manufacturing (Slide 9 CIOE 2018)

Conventional

• Assembled one at a time
• Components placed manually
• Optically align each placement
• High component cost
• High assembly cost
• Final test upon completion

Silicon Photonics

“Monolithic” chip integration, except:
• Lasers not wafer scale so need
active alignment
• High insertion losses, no high volume
commercial integrated mux-demux
• High cost per die and wasted real
estate for laser attach
• Final test upon completion
• A device, not a Platform

Poets's Optical Interposer

Multi-chip module approach
• Use known good die
• No active alignment
• Low insertion losses
• Wafer level assembly, packaging and test
• Low cost per die
• High final yield
• High performance detectors and
integrated mux-demux
• True Platform Technology

https://poet-technologies.com/docs/presentati..._FINAL.pdf

- proto