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Posted On: 09/17/2017 4:40:38 AM
Post# of 872
$LWLG Lightwave's current library of Polymer Photonic components includes slot waveguide modulators, ridge waveguide modulators, passive waveguides, and waveguide splitters.
The component library will be expanded to include multiplexers, demultiplexers, and spot-size converters, necessary in telecom and datacom devices.
Combining these advanced polymer components with increasing density of circuits on silicon will create a compelling portfolio of PIC (Photonics Integrated Circuit) products.
Moore's Law focuses on the doubling of integration density of transistors on a silicon integrated platform every 24 months.
This constant has held steady for the past 40 years to a point where today, a single IC (Integrated Circuit) contains over 2B or 2 x 109 transistors.
Conversely, in the photonics world, the level of maturity is still only in the 100s of photonic devices integrated onto a single chip.
Even with hero research experiments demonstrating several thousand circuits, the level of integration is in its infancy and lags far behind the silicon IC world.
The combination of Polymer Photonics with a silicon platform, such as a slot waveguide modulator coated with a thin coat polymer as the active component, will enable photonics to grow in integration density faster than before, and beyond 1000 photonics devices on a single chip.
Polymer Photonics components are naturally low cost and high performance and allow for high integration scaling design-rules, especially on silicon.
Polymer Photonics can not only address 100 Gbps and beyond computational speeds, but achieve this at low cost, and in a miniaturized format that allows integration levels to start following Moore's Law from a photonics perspective.
This allows for scalability to achieve not only 100 devices, or 1000 devices, but over 10,000 and 100,000 devices on a polymer/silicon platform.
http://www.prnewswire.com/news-releases/moore...88704.html
- proto
The component library will be expanded to include multiplexers, demultiplexers, and spot-size converters, necessary in telecom and datacom devices.
Combining these advanced polymer components with increasing density of circuits on silicon will create a compelling portfolio of PIC (Photonics Integrated Circuit) products.
Moore's Law focuses on the doubling of integration density of transistors on a silicon integrated platform every 24 months.
This constant has held steady for the past 40 years to a point where today, a single IC (Integrated Circuit) contains over 2B or 2 x 109 transistors.
Conversely, in the photonics world, the level of maturity is still only in the 100s of photonic devices integrated onto a single chip.
Even with hero research experiments demonstrating several thousand circuits, the level of integration is in its infancy and lags far behind the silicon IC world.
The combination of Polymer Photonics with a silicon platform, such as a slot waveguide modulator coated with a thin coat polymer as the active component, will enable photonics to grow in integration density faster than before, and beyond 1000 photonics devices on a single chip.
Polymer Photonics components are naturally low cost and high performance and allow for high integration scaling design-rules, especially on silicon.
Polymer Photonics can not only address 100 Gbps and beyond computational speeds, but achieve this at low cost, and in a miniaturized format that allows integration levels to start following Moore's Law from a photonics perspective.
This allows for scalability to achieve not only 100 devices, or 1000 devices, but over 10,000 and 100,000 devices on a polymer/silicon platform.
http://www.prnewswire.com/news-releases/moore...88704.html
- proto
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$MJ
