Navitas Semiconductor Launches Trustworthy SiCPAK™ Modules
Navitas Semiconductor Unveils Next-Gen SiCPAK™ Power Modules
Navitas Semiconductor is excited to announce the launch of its latest SiCPAK™ power modules, which are setting new benchmarks for reliability and high-temperature performance within the power semiconductor industry. The modules utilize innovative epoxy-resin potting technology and proprietary trench-assisted planar SiC MOSFET technology. These enhancements make them suitable for the most demanding high-power applications including Electric Vehicle (EV) DC fast chargers, industrial motor drives, and energy storage systems.
Innovative Design for Extreme Conditions
The newly introduced 1200V SiCPAK™ power modules are specifically engineered to thrive in high-humidity environments. Thanks to advanced epoxy-resin potting technology, they effectively prevent moisture ingress and enhance thermal performance, significantly mitigating degradation caused by power and temperature fluctuations. This design prioritizes durability, contributing to enhanced operational reliability.
Superior Performance Through Rigorous Testing
Performance testing has shown that the SiCPAK™ modules exhibit a five-fold reduction in thermal resistance increase after 1,000 cycles of thermal shock testing when compared to conventional silicone-gel-filled modules. While competing modules failed isolation tests, the epoxy-resin potted SiCPAK™ maintained acceptable isolation levels, marking a substantial advancement in reliability during real-world application.
Advancements in Semiconductor Technology
Backed by over two decades of leadership in silicon carbide (SiC) innovation, Navitas harnesses its GeneSiC™ trench-assisted planar SiC MOSFET technology to deliver unparalleled efficiency. This technology is designed to minimize power losses significantly, enabling operating temperatures that are cooler and ensuring long-term durability across a wide range of applications. With a lower RDS(ON) increase against temperature, these power modules pave the way for substantial performance gains.
Variety in Configuration and Compatibility
The new power modules come equipped with built-in NTC thermistors and offer various ratings from 4.6 m? to 18.5 m? across half-bridge, full-bridge, and 3L-T-NPC configurations. Significantly, they are designed to be pin-to-pin compatible with widely accepted industry-standard press-fit modules. As an added convenience, optional pre-applied Thermal Interface Material (TIM) facilitates a simplified assembly process.
Availability for Mass Production
The SiCPAK™ power modules are now available for mass production, aligning with rising market demands for robust and reliable power solutions. Interested customers can access datasheets for detailed product information.
About Navitas Semiconductor
Navitas Semiconductor (Nasdaq: NVTS) prides itself on being a pure-play, next-generation power-semiconductor innovator with a decade of experience in power innovation, prominently founded in 2014. With an extensive array of patents in their portfolio, the company specializes in GaNFast™ power ICs, which integrate gallium nitride with advanced control, sensing, and protection technologies aimed at enhancing charging speeds, power density, and overall energy efficiency. Their GeneSiC™ power devices provide robust, high-voltage solutions tailored for multiple sectors including AI data centers and renewable energy applications. Navitas is also recognized for its commitment to sustainability, proudly holding a CarbonNeutral® certification.
For more information, please contact Llew Vaughan-Edmunds, Sr Director of Product Management & Marketing at info@navitassemi.com.
Frequently Asked Questions
What are the key features of Navitas' SiCPAK™ power modules?
The SiCPAK™ modules feature epoxy-resin potting technology, a significant reduction in thermal resistance, and compatibility with standard configurations for convenience.
How does the new technology improve performance?
The trench-assisted planar technology enables lower power loss and enhances thermal performance, resulting in increased efficiency and durability of the modules.
Are these power modules suitable for outdoor use?
Yes, the SiCPAK™ modules are specifically designed to withstand high-humidity environments, making them suitable for various outdoor applications.
What applications can benefit from these power modules?
They are designed for industries such as EV charging, industrial motor drives, solar inverters, energy storage systems, and more.
Where can I find more information about the products?
Datasheets and additional information are available on the Navitas Semiconductor website and can also be obtained through direct contact.
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