LQDX Expands Partnership with ASU to Innovate Packaging Solutions
LQDX and Arizona State University Collaborate on Semiconductor Innovations
Focuses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging
LQDX Inc., a prominent developer of high-performance materials for advanced semiconductor packaging, has announced a strategic collaboration with Arizona State University (ASU) to enhance their innovative initiatives. The collaboration will focus on the development of advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP), and utilize LQDX's cutting-edge Liquid Metal Ink (LMI) technology.
Research Partnership Overview
The partnership, which formally commenced in 2024, aims to foster research opportunities within the semiconductor sector. ASU, recognized for its pioneering work in semiconductor packaging research, has established an Advanced Packaging Piloting Facility (PPF). Powered by the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP), this facility provides a unique R&D environment to test new materials and advanced packaging solutions. By partnering with ASU, LQDX intends to bring its Liquid Metal Ink (LMIx) chemistries and process intellectual property to the forefront of semiconductor innovations.
Advantages of the Partnership
“ASU is becoming a pivotal hub for semiconductor innovation within the United States,” stated Simon McElrea, CEO of LQDX. He emphasized the significance of this agreement, underscoring that it deepens the existing partnership and positions both entities strategically to address the escalating demand for advanced semiconductor packaging solutions driven by the latest technological advancement efforts. The joint mission is to actively contribute to the supply of next-generation IC-substrates.
Driving Economic Growth
Professor Hongbin Yu from ASU expressed enthusiasm for the partnership, highlighting its potential to boost economic interests in Arizona while establishing a top-tier semiconductor innovation ecosystem. The collaboration aligns with ASU’s goal of scaling pioneering technologies that promote growth and technological advancement across the nation. LQDX is set to leverage its extensive competencies and resources in the semiconductor sector to maximize the collaboration's impact.
Technological Advancements
The partnership builds upon LQDX's commitment to developing advanced materials that are imperative for AI and high-performance computing applications. As the demand for computing power skyrockets, LQDX’s innovative solutions, such as LMIx technology, emerge as vital resources within the semiconductor packaging landscape. This technology, capable of producing circuits that are significantly denser than conventional Printed Circuit Boards (PCBs), meets the demands of high signal density required by modern chip designs.
About LQDX
LQDX is at the forefront of developing advanced materials and technologies aimed at transforming the semiconductor packaging industry. Established in collaboration with the Stanford Research Institute (SRI), the firm is based in Silicon Valley and focuses on reframing chip interconnect architectures. As artificial intelligence and machine learning applications revolutionize computing landscapes, LQDX's LMIx technology offers a simpler alternative to traditional wafer processing methods, specifically Physical Vapor Deposition (PVD). This technique provides a seamless integration into existing manufacturing frameworks, heralding a new era for semiconductor production.
Frequently Asked Questions
What is the primary focus of the LQDX and ASU partnership?
The partnership primarily aims to advance research in semiconductor packaging, specifically focusing on advanced IC-substrates and Fan Out Wafer Level Packaging.
Why is ASU considered a leader in semiconductor research?
ASU is at the forefront of semiconductor packaging research and has established an Advanced Packaging Piloting Facility to foster innovation.
How does LQDX's technology differ from traditional methods?
LQDX utilizes Liquid Metal Ink technology, which allows for denser circuit production compared to conventional PCB methods, simplifying the overall process.
What economic benefits does this collaboration aim to produce?
The collaboration seeks to enhance economic growth in Arizona by developing advanced semiconductor technologies that contribute to the larger U.S. economy.
How will LQDX support ASU's research initiatives?
LQDX will provide its Liquid Metal Ink chemistries and work closely with ASU to qualify and explore US-centric semiconductor solutions.
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