Compal Revolutionizes Cloud Computing with New AI Server

Compal Launches SG720-2A/OG720-2A AI Server at CloudFest 2025

Compal Electronics makes an impactful entrance at CloudFest 2025 with the unveiling of the SG720-2A/OG720-2A AI server. This innovative server combines high-performance GPU acceleration with advanced two-phase direct-to-chip liquid cooling technology, setting a new standard for energy efficiency and performance in data centers.

Revolutionary Technology Unveiled

The SG720-2A/OG720-2A AI server is a significant advancement in artificial intelligence technology, supporting up to eight AMD Instinct™ MI325X GPUs. These graphics processing units, built on the cutting-edge CDNA 3 architecture, provide impressive Infinity Fabric™ bandwidth, delivering theoretical performance levels that reach 20.9 PFLOPs in FP16 calculations. This number doubles when considering sparsity in computations, showcasing the server’s capacity for powerful data processing capabilities.

Powerful Performance and Efficiency

In addition to its remarkable GPU support, the SG720-2A/OG720-2A incorporates a total of 2TB of high-speed HBM3E memory, which ensures high efficiency and data access speeds surpassing 48TB/s. The integration of ZutaCore® HyperCool® 2-Phase liquid cooling significantly enhances both operational stability and overall performance, allowing the server to thrive under demanding workloads.

Designed for Modern Data Centers

The design of the SG720-2A/OG720-2A features an optimized 850mm deep chassis that fits seamlessly into standard EIA 19" racks. This server is built to enhance efficiency, with hot-pluggable I/O that streamlines management and scalability. The modular architecture makes upgrades straightforward, allowing for quick maintenance without extensive downtime.

Testing and Performance Results

Compal conducted thorough testing to evaluate the efficiency of the direct-to-chip cooling system. The results showed ZutaCore's HyperCool® technology achieved a commendable partial Power Usage Effectiveness (pPUE) of 1.01. In comparison to traditional single-phase cooling systems, HyperCool demonstrated a consistent 5% improvement in pPUE, emphasizing its role in energy conservation and improved thermal management.

CloudFest 2025: A Showcase of Innovation

At CloudFest 2025, Compal, in collaboration with ZutaCore®, highlights the future of data center technologies. Alongside the SG720-2A/OG720-2A, various leading-edge technologies are also on display, reflecting Compal's commitment to advancing AI and high-performance computing solutions. Attendees are invited to experience these groundbreaking innovations firsthand.

About Compal

Founded in 1984, Compal has established itself as a leader in the manufacturing of notebooks and smart devices. The company's dedication to innovation has garnered it numerous international awards. Compal was recently recognized as one of Taiwan's top manufacturers and consistently features in the Forbes Global 2000 and Fortune Global 500 lists. Beyond traditional manufacturing, Compal is expanding into emerging fields such as cloud servers, auto electronics, and smart medical solutions, leveraging its robust R&D capabilities to deliver relevant and effective products.

Frequently Asked Questions

What is the SG720-2A/OG720-2A AI server?

The SG720-2A/OG720-2A is an advanced AI server developed by Compal, featuring high-performance GPUs and cutting-edge liquid cooling technology.

What are the main features of this server?

It supports up to eight AMD GPUs, has a total of 2TB of HBM3E memory, and employs innovative two-phase cooling technology.

How does the cooling system work?

The server uses ZutaCore’s HyperCool® technology, which provides efficient thermal management and maintains a low Power Usage Effectiveness.

Where can I experience the SG720-2A/OG720-2A?

Attendees can visit Compal's exhibit at CloudFest 2025 to see the server and other advanced technologies in action.

What is Compal's history?

Compal has been a prominent manufacturer since 1984, recognized for innovation and quality in computing devices and currently expanding into emerging tech sectors.

About The Author

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