InPsytech Showcases Innovative 3nm UCIe 3.0 Technology
InPsytech, a notable subsidiary of Egis Technology specializing in high-speed interface IP development, made a significant announcement regarding its participation in the Open Compute Project (OCP) Global Summit 2025. InPsytech is set to showcase its latest advancements in 3nm UCIe high-speed interface technology, emphasizing ultra-high-speed and low-power performance. The OCP Summit serves as a key platform for highlighting technological innovations in the semiconductor industry.
High-Speed and Low-Power UCIe Technology
The company’s focus on developing high-speed, low-power interface technologies has led to the creation of its UCIe (Universal Chiplet Interconnect Express) portfolio, which is optimized for advanced semiconductor processes down to 3nm. The impressive capabilities of this new IP support data transfer rates that soar up to 64 GT/s, catering to both 2.5D and 3D packaging architectures essential for efficient chip-to-chip interconnects. This showcases InPsytech's commitment to enhancing the Chiplet ecosystem.
Collaboration with Alcor Micro
InPsytech's contributions extend to vital collaborations, especially with Alcor Micro Corp. Together, they are advancing the Arm Chiplet ecosystem. Alcor Micro’s latest Mobius100 (CSS V3) platform integrates InPsytech’s UCIe technology, highlighting a solid collaboration aimed at enhancing heterogeneous computing. This synergy between InPsytech and Alcor Micro is indicative of the innovative direction in chip architecture and design.
Insights from InPsytech’s Leadership
David Hsu, COO of InPsytech, expressed pride in showcasing their leadership in the industry alongside esteemed partners like Alcor Micro. Hsu’s insights reflect a strong optimism for the future of UCIe technology within the Arm Chiplet ecosystem. The belief is that such innovations will pave the way for greater adoption of chiplet-based designs across the semiconductor landscape.
Event and Exhibition Details
The OCP Global Summit 2025 is set to take place at the San Jose Convention Center, scheduled from October 13–16, 2025. This event will provide a platform for InPsytech to exhibit its cutting-edge 3nm UCIe 3.0 demo featuring 3D packaging support. The company’s location within the Innovation Village Zone will ensure high visibility among industry leaders and innovators.
Frequently Asked Questions
What is InPsytech's main focus in technology?
InPsytech specializes in high-speed interface intellectual property, particularly focusing on low-power and high-speed interface technologies.
What is the significance of UCIe technology?
UCIe (Universal Chiplet Interconnect Express) technology allows for efficient chip-to-chip interconnections, essential for advancing heterogeneous integration in semiconductor design.
Who did InPsytech collaborate with for their latest demo?
InPsytech collaborated with Alcor Micro Corp., showcasing their technology in the Mobius100 platform at the OCP Summit.
When and where is the OCP Global Summit taking place?
The OCP Global Summit is scheduled for October 13–16, 2025, at the San Jose Convention Center in California.
What are the expectations for UCIe technology in the future?
There is strong confidence that UCIe technology will accelerate the adoption of chiplets, bringing innovative breakthroughs to the global semiconductor industry.
