Introduction of CeleritasSF and CeleritasBU Products
Advanced Chip and Circuit Materials Inc. (ACCM) has recently paved the way for innovation in the electronics industry with the introduction of CeleritasSF and CeleritasBU products. These offerings are aimed at meeting the growing demand for ultra-high-speed, multilayer printed circuit boards (PCBs). With advanced technologies integrated into their production, ACCM is focusing on enhancing performance in modern electronic applications.
What are CeleritasSF and CeleritasBU?
The CeleritasSF and CeleritasBU series are ultra-thin laminates and prepreg materials specifically designed for high layer count PTH, Buildup, and Ultra-High-Density Interconnect (UHDI) multilayer PCBs. They are engineered to support PCIe Gen 6 and 7 with data rates reaching up to 224 Gb/s per channel. This makes them ideal for applications that require fast data transfer and superior reliability.
Environmental Considerations and Material Properties
One significant feature of ACCM's new products is their environmentally-friendly construction. Both CeleritasSF and CeleritasBU utilize a halogen-free and PFAS-free resin system. This choice underscores ACCM's commitment to sustainable manufacturing practices while delivering materials that can effectively eliminate skew. The ultra-thin design alongside very low Z-axis coefficients of thermal expansion (z-CTE) ensures that these materials easily adapt to conventional FR-4 processing equipment, thus catering to high-reliability printed circuit applications.
Revolutionizing PCB Design
The introduction of these products is a game-changer for PCB designers. According to Michael Gay, Vice President of Marketing at ACCM, the CeleritasSF series exhibits comparable dielectric performance to PTFE materials, holding strong thermal performance that exceeds high-reliability expectations. This innovation opens up possibilities for designers to leverage on-board copper channels efficiently, allowing them to achieve astonishing data rates of up to 224 Gbps.
Advancements in Dielectric Technology
With the rising demand for ultrathin dielectrics with low dielectric constant (DK) and low dissipation factors in the substrate market, CeleritasBU products have emerged as an essential solution. These products are designed to not only provide exceptional shelf life but also to minimize loss and DK, addressing the critical needs of modern electronic applications.
Exhibiting at DesignCon 2025
As part of ACCM’s ongoing promotion of their innovative products, the company will showcase the CeleritasSF and CeleritasBU series at the upcoming DesignCon 2025 exhibition. Attendees are invited to visit Booth #901 to learn more about these groundbreaking materials and their transformative potential in the PCB manufacturing landscape.
About Advanced Chip and Circuit Materials
Advanced Chip and Circuit Materials, Inc. (ACCM) is a materials science company based in San Jose, California. With a significant manufacturing facility located in Wisconsin, ACCM specializes in producing advanced Buildup and UHDI dielectric materials to cater to global customers. Their focus on innovation and quality positions them as a leader in the material science sector.
Frequently Asked Questions
What are the new products introduced by ACCM?
ACCM has introduced the CeleritasSF and CeleritasBU products designed for ultra-high-speed PCBs, supporting data rates of up to 224 Gb/s.
What makes CeleritasSF and CeleritasBU unique?
These products are notable for being halogen-free, PFAS-free, and designed to eliminate skew while offering excellent thermal cycling capabilities.
Where can I find more information about the products?
More information can be obtained by visiting ACCM's booth at DesignCon 2025 or by reaching out via email for product samples.
How do these materials benefit PCB manufacturers?
They provide improved reliability, thermal performance, and support for high-speed data transmission, making them suitable for advanced electronics.
What is the background of ACCM?
ACCM is a US-based materials science company known for producing advanced dielectric materials for multilayer PCB applications.
