Innovative Advancements from E&R Engineering at SEMICON SEA
E&R Engineering Corp. is excited to announce its participation in the highly anticipated SEMICON Southeast Asia event. This premier show will be hosted at the Sands Expo & Convention Centre, showcasing an impressive array of cutting-edge technologies in the semiconductor sector.
With over three decades of expertise, E&R Engineering is committed to pushing the frontiers of semiconductor manufacturing. The annual SEMICON SEA event serves as a global platform for industry leaders, innovators, and professionals to explore the newest developments and technologies that are shaping the future of electronics.
This year, E&R will collaborate with leading partners—Zen Voce and GP Group—to present a unified front at the event. Combining their extensive experience in various domains of the semiconductor industry, this strategic alliance represents the idea that together, they can achieve significantly more than they could alone.
Highlighting Cutting-Edge Solutions
During the exhibition, E&R will reveal some of its most advanced solutions in laser and plasma technology. Here’s a glimpse of what attendees can expect:
Plasma Dicing Technology
E&R Engineering’s innovative plasma dicing solution integrates hybrid laser grooving. This technology is designed for ultra-fine dicing applications, supporting die lanes as narrow as 10 to 30 micrometers. E&R offers a complete dicing service, adept at managing unique geometrical shapes such as hexagons and circles with high precision.
Fan-Out Panel Level Packaging (FOPLP)
The company's FOPLP solution is particularly noteworthy, designed for large panel processes. It includes functionalities such as laser cutting, marking, cleaning, and post-drill procedures, all while maintaining unparalleled control over warpage of up to 16 millimeters. The process is further refined with laser debonding and plasma dry etching for improved panel separation.
Transformational Glass Substrate Solutions
Taking the lead in glass core technology, E&R delivers high-productivity solutions including:
- Rapid TGV drilling capabilities, achieving up to 1,000 vertical penetration strokes per second, with extraordinary precision.
- Laser polishing technology for optimizing sidewall roughness.
- Laser beveling combined with precision automated optical inspection for accurate defect detection.
Advanced Packaging Innovations
E&R is also at the forefront of advanced packaging solutions, providing:
- Precision laser drilling techniques suitable for 2.5D and 3D integrated circuits, ensuring high accuracy levels.
- An innovative hybrid laser and plasma approach for through-silicon vias.
- Multi-beam laser marking with high accuracy and throughput capabilities.
- Controlled thermal cutting solutions using advanced laser technologies.
E&R Engineering invites all interested attendees to visit their booth at SEMICON SEA 2025, where they will be showcasing how their collaboration with Zen Voce and GP Group is set to redefine the landscape of semiconductor manufacturing.
Booth Details and Event Information
- Booth Number: #L2413
- Location: Sands Expo & Convention Centre
- Event Dates: May 20-22
Frequently Asked Questions
What is SEMICON SEA?
SEMICON SEA is a key exhibition focused on semiconductor technology and innovation, bringing together industry leaders and professionals from around the globe.
Where will E&R Engineering be exhibiting?
E&R Engineering will exhibit at the Sands Expo & Convention Centre, showcasing advanced semiconductor technologies.
What are the main highlights of E&R's showcase?
E&R will feature its latest plasma dicing technology, fan-out panel level packaging solutions, and advancements in glass substrate processing.
Who are E&R Engineering's partners at the event?
E&R is collaborating with Zen Voce and GP Group to present a powerful combination of expertise and innovation.
When is SEMICON SEA taking place?
The event is scheduled for May 20-22, 2025, providing ample opportunity for attendees to engage with the latest industry developments.
