E&R Engineering to Showcase at SEMICON Taiwan 2025
E&R Engineering will present its latest innovations in laser and plasma technology at SEMICON Taiwan 2025. As industries pivot towards AI, high-performance computing, and 5G, the advanced packaging sector has emerged as a key focus area. Market analyses suggest that the packaging market is projected to surpass USD 50 billion, with fan-out panel-level packaging (FOPLP) anticipated to grow over 15% annually.
Advanced Packaging Solutions Offered
This year at SEMICON, E&R Engineering (TPE: 8027) will introduce a variety of advanced packaging solutions including FOPLP, Through-Silicon Via (TSV), Through-Glass Via (TGV), and advanced plasma dicing technology. These innovations are designed to help clients tackle challenges related to high-input/output density, warpage, and ultra-fine features.
Highlighting FOPLP Solutions
E&R Engineering boasts a comprehensive equipment portfolio that features advanced laser marking, dicing, plasma cleaning, and laser debonding technologies. Their systems are capable of supporting panels measuring up to 700×700 mm, providing precise control to maintain productivity even while processing substrates that may warp up to 16 mm.
Importance of TSV Technology
Through-Silicon Via (TSV) technology is becoming increasingly vital as the demand for 3D packaging and advanced memory continues to rise. E&R delivers a suite of TSV solutions including via drilling, cleaning, and debonding processes, effectively combining laser and plasma technologies to ensure precise via profiles with minimal defects. This ensures reliable interconnects, catering to diverse wafer sizes and materials.
Innovations in Glass Substrate Applications
In the growing segment of glass core substrates, E&R's laser modification technology can achieve over 0.9 via circularity, 10:1 aspect ratios, and can drill 1,500 vias per second. These solutions align with CoPoS and ABF substrate applications, aiming to foster high-performance and high-yield manufacturing outputs. E&R will be showcasing a complete metallization-enabled glass substrate processing flow in collaboration with its E-core partners.
Comprehensive Packaging and Process Support
All E&R equipment is designed, manufactured, and tested in Taiwan, featuring components sourced from esteemed U.S. and European suppliers. The company has successfully shipped over 500 units globally, with its technologies widely adopted in Flip Chip BGA, fan-out, wafer-level packaging, and other formats by leading OSATs and IDMs. Additionally, E&R has expanded its Flip Chip BGA portfolio to include offerings such as Pre-Flip Chip Die Bond Plasma Cleaning, Pre-Molding/Underfill Plasma Cleaning, and Laser Marking solutions for enhanced traceability. In a significant milestone, E&R launched a fully automated high-power burn-in solution in 2025, which supports test environments of up to 3,000W.
Connect with E&R Engineering at SEMICON Taiwan 2025
The company is looking forward to welcoming industry partners at SEMICON Taiwan 2025, where you can explore the next generation of packaging and dicing technologies alongside their experienced technical team.
Event Details
SEMICON Taiwan 2025 will be held at the Taipei Nangang Exhibition Center, Hall 1. E&R Engineering can be found at Booth 4F, #N0968. The event is scheduled from September 10 to September 12, 2025. For further details, attendees can explore the official website.
Frequently Asked Questions
What technologies will E&R showcase at SEMICON Taiwan 2025?
E&R will showcase advanced laser and plasma solutions including FOPLP, TSV, TGV, and plasma dicing technologies.
Why is advanced packaging important?
Advanced packaging plays a crucial role in meeting the demands of semiconductor innovations driven by AI, HPC, and 5G technologies.
What are the benefits of E&R's FOPLP solutions?
E&R's FOPLP solutions offer high productivity and can effectively handle substrates with warpage, making them suitable for modern semiconductor applications.
What is the significance of TSV technology?
TSV technology is essential for enabling high-density integration in 3D packaging and advanced memory solutions.
How can industry partners connect with E&R during the event?
Industry partners can visit E&R's booth at SEMICON Taiwan 2025 to discuss the latest advancements in packaging and dicing technologies with their technical team.
