CoreFlow Introduces Advanced Vacuum Stage for CoPoS Packaging
Specifically designed to address severe warpage issues in semiconductor substrates while ensuring compatibility with existing systems.
CoreFlow Ltd., a prominent name in high-performance handling solutions for the semiconductor field, has unveiled its next-generation vacuum stage tailored for warped panel handling. This advanced unit caters to the modern CoPoS (Chip-on-Panel-on-310 mm × 310 mm substrate) packaging processes.
Utilizing CoPoS substrates translates to up to 81% more usable area compared to standard 300 mm wafers. The technology fosters greater device density and enhances manufacturing efficacy, which is vital for today’s AI-driven advancements.
Addressing Warpage in Semiconductor Manufacturing
CoreFlow's latest innovation is an evolution of the vacuum chucks employed in 300 mm wafer processes, now adapted to meet the demands of next-generation CoPoS panel-level packaging.
The CEO of CoreFlow, Alon Segal, acknowledges the significant challenge of substrate warpage in manufacturing processes. He states, “With our extensive experience in silicon wafer and glass substrate technologies, this new 310 mm × 310 mm PLP vacuum stage incorporates sophisticated aeromechanical designs for accurate, clamp-free flattening. The stage is fully compatible with standard fabrication utilities, ensuring seamless integration into current metrology, lithography, and inspection systems.”
Product Configuration and Customization Options
This new vacuum stage is now available for orders in either Selective Vacuum or GripJet formats. Optional features include specific surface finishes, ESD coatings, and custom lift-pin assemblies, accommodating various operational preferences. CoreFlow supports tailored modifications to meet unique customer requirements, with standard delivery times expected to range from 8 to 12 weeks.
About CoreFlow
CoreFlow Ltd. is recognized as a leading developer and manufacturer of advanced substrate-handling systems utilized throughout the semiconductor, FPD, and solar industries. Since its establishment in 1999, the company has pioneered aeromechanical innovations, with its patented handling technologies deployed around the world. The company’s operational headquarters and research and development center are located in Daliat-El Carmel, Mt. Carmel, Israel. Production and support teams serve markets across Korea, Taiwan, Japan, and China.
If you are interested in further information or would like to schedule a technical briefing, please reach out to our media contacts or visit our website for updates.
Frequently Asked Questions
What is the purpose of CoreFlow's new vacuum stage?
The new vacuum stage is designed to precisely flatten warped glass substrates used in CoPoS panel-level packaging, improving manufacturing efficiency.
How does the vacuum stage improve substrate handling?
It leverages advanced aeromechanical design to enable clamp-free flattening, which is essential for the accurate positioning of semiconductor panels during processing.
What configurations are available for this vacuum stage?
The vacuum stage can be ordered in Selective Vacuum or GripJet configurations, tailored to specific operational needs of clients.
What benefits do CoPoS substrates offer?
CoPoS substrates provide significantly more usable area than traditional wafers, allowing for higher device density and greater efficiency in advanced manufacturing processes.
How can customers obtain more information about CoreFlow's products?
Customers can reach out via the contact provided on CoreFlow's official website or schedule a technical briefing for detailed insights.
