Chiplet Summit 2024: Pre-Conference Details
The anticipation is building for the third annual Chiplet Summit, a pivotal event for professionals in the chiplet industry. Set to take place at the Santa Clara Convention Center, this summit aims to unite industry experts and practitioners on January 21-23. The focus this year is particularly aimed at enhancing knowledge across diverse aspects of chiplet technology, and the pre-conference day promises a robust lineup of tutorials and discussions designed to cater to professionals at various levels of expertise.
Tutorial Schedule Overview
The pre-conference day offers an engaging schedule filled with valuable tutorial sessions. Each session is crafted to ensure participants gain insights and practical knowledge relevant to current trends and challenges in the chiplet arena.
Morning Sessions
The morning tutorials, running from 8:30 AM until noon, encompass crucial subjects such as:
- Chiplet Basics - A fundamental introduction to chiplets.
- Advanced Packaging Methods - Exploring the latest in packaging technologies.
- Introduction to Die-to-Die Interfaces - Sponsored by Alphawave Semi, this session provides insights into key connection methods.
Afternoon Sessions
The afternoon schedule, from 1:00 PM to 5:00 PM, covers more advanced topics including:
- Design Methods - Focusing on effective design strategies for chiplets.
- Working with Foundries - Guidance on collaboration with manufacturing facilities.
- Applying Die-to-Die Interfaces - A continuation of morning discussions, with sponsorship from the UCIe Consortium.
- Open Chiplet Economy - Insights sponsored by the Open Compute Project.
Additional Topics and Features
In addition to the tutorials, special coverage will delve into the latest updates concerning UCIe and the recent research conducted by the CEA. Topics will explore advancements in distributed large-scale AI systems that leverage co-packaged optics and silicon photonics. A specific report will highlight the evolving open chiplet economy, creating opportunities for designers to effortlessly integrate chiplets from an accessible marketplace.
Interactive Learning Experiences
The summit will also feature a Superpanel discussion titled "Chiplets - The Key to Solving the AI Energy Gap." The inclusion of this panel reflects the growing importance of chiplet technology in addressing significant challenges in artificial intelligence. Moreover, participants will benefit from engaging one-on-one interactions at an expert table session. This is designed to facilitate valuable dialogues between attendees and seasoned professionals who can provide insights into pressing issues within the industry.
Chuck Sobey, the Summit General Chair, emphasizes the importance of the pre-conference day: "Attendees interested in design, packaging, testing, or integration can take advantage of this opportunity to gain insights into advancements in various fields. At the same time, those new to the field can familiarize themselves with the foundational elements of these diverse tasks. Everyone on board will benefit immensely from the superpanel on AI, where attendees are encouraged to bring their queries for expert discussion."
Contact Information for Exhibiting Opportunities
If you're considering exhibiting at the Chiplet Summit or have any questions regarding the event, please reach out to:
Elizabeth Leventhal, Exhibit Sales Director
Contact: +1.760.809.5755
Email: Elizabeth@ChipletSummit.com
About Chiplet Summit
The Chiplet Summit is an initiative spearheaded by Semper Technologies, targeting the rapidly evolving chiplet market. This event serves as a platform to highlight innovations and advancements, bridging gaps between emerging technologies and industry practitioners.
Frequently Asked Questions
What topics will be covered in the pre-conference tutorials?
The pre-conference will cover topics including Chiplet Basics, Advanced Packaging Methods, and Design Methods among others.
Who can attend the Chiplet Summit?
The summit is designed for everyone from industry veterans to newcomers keen to understand chiplet technology and its applications.
Is there an opportunity to engage with industry experts?
Yes, the summit will feature one-on-one sessions for attendees to interact with experts on various topics related to chiplets.
Can I participate in the special tutorials?
Absolutely! The tutorials are open to registered attendees, ensuring a rich learning experience.
How can I get more information about exhibiting?
You can contact Elizabeth Leventhal, Exhibit Sales Director, for inquiries regarding exhibiting opportunities.
