ACM Research Expands FOPLP Portfolio with Innovative Tool
Introducing a new double-sided bevel etching system that boosts efficiency and reliability for copper-related applications, enabling high-precision features on large panels.
ACM Research, Inc. (NASDAQ: ACMR), a leading provider of wafer processing solutions in the semiconductor industry and advanced wafer-level packaging, has launched the Ultra C bev-p panel bevel etching tool specifically designed for fan-out panel-level packaging (FOPLP) applications. This cutting-edge technology is engineered for bevel etching and cleaning processes related to copper, which is crucial for preserving the integrity of large panels.
Transforming the Etching Process
According to Dr. David Wang, the president and CEO of ACM, the significance of FOPLP is on the rise as it meets the increasing demands of contemporary electronic applications. This approach offers benefits in integration density, cost-effectiveness, and design flexibility. The Ultra C bev-p tool showcases ACM's deep expertise in wet processing, delivering advanced performance features, including double-sided bevel etching that streamlines horizontal panel applications. Together with recent innovations like the Ultra ECP ap-p for horizontal panel electrochemical plating, this tool is poised to make a significant impact on the FOPLP market.
Notable Features of the Ultra C bev-p Tool
This groundbreaking etching tool serves as an essential element for FOPLP operations, utilizing a wet etching technique that emphasizes bevel etching and the removal of copper residues. This careful process is vital for preventing electrical shorts, reducing contamination risks, and ensuring the integrity of subsequent processing stages, which are crucial for the long-term reliability of semiconductor devices.
ACM's patented technology effectively tackles the unique challenges posed by square panel substrates. The Ultra C bev-p guarantees a precise and controlled bevel removal process—even for warped panels—ensuring optimal reliability and performance that are essential for advanced semiconductor technologies.
Advanced Panel Handling
The Ultra C bev-p is specifically engineered for panel substrates and is compatible with organic, glass, and bonding panels. It efficiently manages both front and back panel processing, accommodating sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thickness options ranging from 0.5 mm to 3 mm, while also handling warpage up to 10 mm.
Efficient Copper Removal
The tool employs a diluted sulfuric acid and peroxide solution for effective copper removal, complemented by deionized water for rinsing and N2 for final drying. This meticulous process guarantees a clean, dry surface that is critical for subsequent operations.
High Throughput and Reliability
With the capability to operate up to six processing chambers, the Ultra C bev-p achieves an impressive throughput of 40 panels per hour (PPH), effectively addressing high-volume production needs. The system maintains bevel control accuracy of ±0.2 mm, with a control range of 0-20 mm and a mean time between failures (MTBF) of 500 hours. An uptime rate of 95% ensures outstanding reliability and consistent performance, making this tool a fundamental asset for efficient semiconductor manufacturing.
About ACM Research, Inc.
ACM Research specializes in the development, manufacturing, and sale of semiconductor process equipment. The company focuses on single-wafer or batch wet cleaning, electroplating, stress-free polishing, and various critical processes essential for advanced semiconductor device manufacturing. ACM is committed to delivering tailored, high-performance, and cost-effective solutions that enhance productivity and yield in semiconductor production.
Frequently Asked Questions
What is the Ultra C bev-p tool used for?
The Ultra C bev-p tool is designed for bevel etching and cleaning in copper-related processes for fan-out panel-level packaging applications, enhancing efficiency and reliability.
How does the Ultra C bev-p improve processing?
It utilizes innovative wet etching techniques to ensure precise bevel removal, prevents electrical shorts, and maintains the integrity of devices during production.
What type of panels can the Ultra C bev-p handle?
The tool is compatible with organic, glass, and bonding panels, accommodating varying sizes and thicknesses effectively.
What are the benefits of using the Ultra C bev-p?
Benefits include improved process efficiency, reduced contamination risks, a high throughput rate, and enhanced reliability in semiconductor manufacturing.
Who is ACM Research, Inc.?
ACM Research is a leading supplier of wafer processing solutions focused on developing advanced semiconductor process equipment critical for efficient manufacturing.
