Kioxia and MoDeCH Unveil Groundbreaking 3D Probing Technology
Kioxia and MoDeCH Unveil Groundbreaking 3D Probing Technology
Kioxia Corporation, a world leader in memory solutions, and MoDeCH Inc., a prominent developer of modeling and design technology, have introduced an industry-first three-dimensional probing system. This new system, showcased at The European Microwave Conference, allows for high-frequency characteristic measurement of three-dimensional (3D) objects up to an impressive 110 GHz.
Revolutionizing High-Frequency Measurement
Traditionally, solid-state drives (SSDs) in data centers connect to high-speed interface connectors on processor motherboards. These setups typically rely on simulations to evaluate the high-frequency characteristics of the 3D structures utilized within. The introduction of this cutting-edge 3D probing system marks a significant advancement, enabling direct measurement of these characteristics at frequencies reaching 110 GHz for the first time.
The Innovative 3D Probe Station
To facilitate this groundbreaking capability, Kioxia and MoDeCH developed a specialized 3D probe station that efficiently measures high-frequency characteristics of these complex structures. This station features a unique mechanism that simultaneously rotates high-frequency probes along with frequency extenders, establishing optimal contact with 3D structures for precise measurements.
Thru Standards for Accuracy
To enhance measurement accuracy, the partner companies also devised thru standards tailored for individual 3D structures. For example, to effectively evaluate a vertically bent 3D structure, they created a thru on a flexible substrate that could be manipulated using a jig, ensuring accurate measurements with the establishment of fixed standards.
Successful Performance Testing
Using the innovative 3D probing system alongside the newly established thru standards, Kioxia and MoDeCH were able to successfully conduct high-frequency characteristic measurements on two transmission lines at 110 GHz. These transmission lines were interconnected via orthogonal connectors, showcasing the system's effectiveness and reliability.
Supporting Future Technologies
This remarkable advancement stems from the "Research and Development Project of the Enhanced Infrastructures for Post 5G Information and Communication Systems," commissioned by the New Energy and Industrial Technology Development Organization (NEDO). Such initiatives exemplify the commitment of both Kioxia and MoDeCH to lead in technological innovations that support the future of electronic communications and data transmission.
Who are MoDeCH and Kioxia?
MoDeCH specializes in developing cutting-edge modeling and design technology designed specifically for the electronics industry. Their expertise encompasses model creation for electronic components, semiconductor and passive device modeling, and circuit design support that significantly aids companies in digitalizing their manufacturing processes.
Kioxia plays a pivotal role in the memory solutions domain and is recognized for its dedication to advancing memory technology. Originating from Toshiba Memory’s spinoff in April 2017, Kioxia continues the legacy of innovation in NAND flash memory technology that began in 1987. By focusing on memory-based products and solutions, Kioxia aims to create additional value for customers and society through the acclaimed BiCS FLASH™ technology. This advanced 3D flash memory technology is critical in high-density applications, supporting industries from advanced smartphones to data centers.
Frequently Asked Questions
What is the purpose of the new 3D probing system?
The 3D probing system allows for direct high-frequency characteristic measurements of 3D structures up to 110 GHz, a first in the industry.
How does the probe station work?
It incorporates a mechanism that rotates probes and frequency extenders simultaneously to establish contact with the 3D structure, facilitating accurate measurements.
Why are thru standards important?
Thru standards ensure accurate measurements of high-frequency characteristics, especially for complex 3D structures, improving reliability in testing.
What companies are involved in this technology?
Kioxia Corporation and MoDeCH Inc. are the two entities collaborating to develop this innovative probing technology.
What industries could benefit from this technology?
Industries focusing on high-speed data transmission technologies, such as telecommunications, automotive, and cloud data management, stand to benefit significantly from these advancements.
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